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contributor authorJohn H. Lau
contributor authorRichard J. Prosman
date accessioned2017-05-08T23:46:54Z
date available2017-05-08T23:46:54Z
date copyrightJune, 1995
date issued1995
identifier issn1528-9044
identifier otherJEPAE4-26149#165_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/115151
publisherThe American Society of Mechanical Engineers (ASME)
titleChip on Board: Technologies for Multichip Modules
typeJournal Paper
journal volume117
journal issue2
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2792085
journal fristpage165
identifier eissn1043-7398
keywordsMulti-chip modules
treeJournal of Electronic Packaging:;1995:;volume( 117 ):;issue: 002
contenttypeFulltext


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