Solder Joint Reliability—Theory and ApplicationsSource: Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 001::page 100DOI: 10.1115/1.2905434Publisher: The American Society of Mechanical Engineers (ASME)keyword(s): Reliability theory AND Solder joints ,
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| contributor author | John H. Lau | |
| contributor author | Peter A. Engel | |
| date accessioned | 2017-05-08T23:38:09Z | |
| date available | 2017-05-08T23:38:09Z | |
| date copyright | March, 1992 | |
| date issued | 1992 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26127#100_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/110086 | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Solder Joint Reliability—Theory and Applications | |
| type | Journal Paper | |
| journal volume | 114 | |
| journal issue | 1 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2905434 | |
| journal fristpage | 100 | |
| identifier eissn | 1043-7398 | |
| keywords | Reliability theory AND Solder joints | |
| tree | Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 001 | |
| contenttype | Fulltext |