Solder Joint Reliability—Theory and Applications
contributor author | John H. Lau | |
contributor author | Peter A. Engel | |
date accessioned | 2017-05-08T23:38:09Z | |
date available | 2017-05-08T23:38:09Z | |
date copyright | March, 1992 | |
date issued | 1992 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26127#100_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/110086 | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Solder Joint Reliability—Theory and Applications | |
type | Journal Paper | |
journal volume | 114 | |
journal issue | 1 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.2905434 | |
journal fristpage | 100 | |
identifier eissn | 1043-7398 | |
keywords | Reliability theory AND Solder joints | |
tree | Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 001 | |
contenttype | Fulltext |