Reliability of Lead-Free Solder JointsSource: Journal of Electronic Packaging:;2006:;volume( 128 ):;issue: 003::page 297Author:John H. Lau
DOI: 10.1115/1.2229234Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Reliability of the restriction of the use of certain hazardous substances in electrical and electronic equipment compliant products is investigated in this study. Emphasis is placed on the lead-free solder joint reliability. Solder is the electrical and mechanical “glue” of electronics assemblies. Will lead-free solders provide the characteristics necessary to allow the world to depend on it in the future? This paper cannot answer this question; however, it will help all participants in the soldering world better understand what needs to be done in order to answer this question and plan for the future.
keyword(s): Reliability , Lead-free solders , Solder joints AND Solders ,
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| contributor author | John H. Lau | |
| date accessioned | 2017-05-09T00:19:36Z | |
| date available | 2017-05-09T00:19:36Z | |
| date copyright | September, 2006 | |
| date issued | 2006 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26264#297_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/133536 | |
| description abstract | Reliability of the restriction of the use of certain hazardous substances in electrical and electronic equipment compliant products is investigated in this study. Emphasis is placed on the lead-free solder joint reliability. Solder is the electrical and mechanical “glue” of electronics assemblies. Will lead-free solders provide the characteristics necessary to allow the world to depend on it in the future? This paper cannot answer this question; however, it will help all participants in the soldering world better understand what needs to be done in order to answer this question and plan for the future. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Reliability of Lead-Free Solder Joints | |
| type | Journal Paper | |
| journal volume | 128 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2229234 | |
| journal fristpage | 297 | |
| journal lastpage | 301 | |
| identifier eissn | 1043-7398 | |
| keywords | Reliability | |
| keywords | Lead-free solders | |
| keywords | Solder joints AND Solders | |
| tree | Journal of Electronic Packaging:;2006:;volume( 128 ):;issue: 003 | |
| contenttype | Fulltext |