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contributor authorJohn H. Lau
date accessioned2017-05-09T00:19:36Z
date available2017-05-09T00:19:36Z
date copyrightSeptember, 2006
date issued2006
identifier issn1528-9044
identifier otherJEPAE4-26264#297_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/133536
description abstractReliability of the restriction of the use of certain hazardous substances in electrical and electronic equipment compliant products is investigated in this study. Emphasis is placed on the lead-free solder joint reliability. Solder is the electrical and mechanical “glue” of electronics assemblies. Will lead-free solders provide the characteristics necessary to allow the world to depend on it in the future? This paper cannot answer this question; however, it will help all participants in the soldering world better understand what needs to be done in order to answer this question and plan for the future.
publisherThe American Society of Mechanical Engineers (ASME)
titleReliability of Lead-Free Solder Joints
typeJournal Paper
journal volume128
journal issue3
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2229234
journal fristpage297
journal lastpage301
identifier eissn1043-7398
keywordsReliability
keywordsLead-free solders
keywordsSolder joints AND Solders
treeJournal of Electronic Packaging:;2006:;volume( 128 ):;issue: 003
contenttypeFulltext


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