Bending and Twisting of 60Sn40Pb Solder Interconnects With CreepSource: Journal of Electronic Packaging:;1994:;volume( 116 ):;issue: 002::page 154Author:John H. Lau
DOI: 10.1115/1.2905504Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An exact analysis is presented for the creep deformation of a thin-walled circular solder cylinder under the actions of bending and twisting moments. Dimensionless interaction curves and charts which relate the variables, interconnect geometry, solder material properties, bending moment, twisting moment, curvature rate, and twist rate are also provided for engineering practice convenience.
keyword(s): Creep , Solders , Materials properties , Cylinders AND Geometry ,
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| contributor author | John H. Lau | |
| date accessioned | 2017-05-08T23:43:58Z | |
| date available | 2017-05-08T23:43:58Z | |
| date copyright | June, 1994 | |
| date issued | 1994 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26142#154_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/113451 | |
| description abstract | An exact analysis is presented for the creep deformation of a thin-walled circular solder cylinder under the actions of bending and twisting moments. Dimensionless interaction curves and charts which relate the variables, interconnect geometry, solder material properties, bending moment, twisting moment, curvature rate, and twist rate are also provided for engineering practice convenience. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Bending and Twisting of 60Sn40Pb Solder Interconnects With Creep | |
| type | Journal Paper | |
| journal volume | 116 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2905504 | |
| journal fristpage | 154 | |
| journal lastpage | 157 | |
| identifier eissn | 1043-7398 | |
| keywords | Creep | |
| keywords | Solders | |
| keywords | Materials properties | |
| keywords | Cylinders AND Geometry | |
| tree | Journal of Electronic Packaging:;1994:;volume( 116 ):;issue: 002 | |
| contenttype | Fulltext |