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contributor authorJohn H. Lau
date accessioned2017-05-08T23:43:58Z
date available2017-05-08T23:43:58Z
date copyrightJune, 1994
date issued1994
identifier issn1528-9044
identifier otherJEPAE4-26142#154_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/113451
description abstractAn exact analysis is presented for the creep deformation of a thin-walled circular solder cylinder under the actions of bending and twisting moments. Dimensionless interaction curves and charts which relate the variables, interconnect geometry, solder material properties, bending moment, twisting moment, curvature rate, and twist rate are also provided for engineering practice convenience.
publisherThe American Society of Mechanical Engineers (ASME)
titleBending and Twisting of 60Sn40Pb Solder Interconnects With Creep
typeJournal Paper
journal volume116
journal issue2
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2905504
journal fristpage154
journal lastpage157
identifier eissn1043-7398
keywordsCreep
keywordsSolders
keywordsMaterials properties
keywordsCylinders AND Geometry
treeJournal of Electronic Packaging:;1994:;volume( 116 ):;issue: 002
contenttypeFulltext


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