On Murphy’s Integrated Circuit Yield IntegralSource: Journal of Electronic Packaging:;1995:;volume( 117 ):;issue: 002::page 159Author:John H. Lau
DOI: 10.1115/1.2792084Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An approximated closed-form integrated circuit (IC) yield formula based on a Gaussian defect density distribution for the compounder in Murphy’s yield integral is presented. Also, a closed-form solution for the average number of faults (AD0 ) in an IC is obtained for a given IC yield (Y). Furthermore, based on the new IC yield formula a simple equation for determining the number of yielded chips in a wafer is given. Finally, the multichip module yield (Ym ) and resultant shipped multichip module yield (Yms ) based on the new IC yield formula are provided.
keyword(s): Integrated circuits , Formulas , Multi-chip modules , Density , Semiconductor wafers AND Equations ,
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| contributor author | John H. Lau | |
| date accessioned | 2017-05-08T23:46:55Z | |
| date available | 2017-05-08T23:46:55Z | |
| date copyright | June, 1995 | |
| date issued | 1995 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26149#159_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/115165 | |
| description abstract | An approximated closed-form integrated circuit (IC) yield formula based on a Gaussian defect density distribution for the compounder in Murphy’s yield integral is presented. Also, a closed-form solution for the average number of faults (AD0 ) in an IC is obtained for a given IC yield (Y). Furthermore, based on the new IC yield formula a simple equation for determining the number of yielded chips in a wafer is given. Finally, the multichip module yield (Ym ) and resultant shipped multichip module yield (Yms ) based on the new IC yield formula are provided. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | On Murphy’s Integrated Circuit Yield Integral | |
| type | Journal Paper | |
| journal volume | 117 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2792084 | |
| journal fristpage | 159 | |
| journal lastpage | 164 | |
| identifier eissn | 1043-7398 | |
| keywords | Integrated circuits | |
| keywords | Formulas | |
| keywords | Multi-chip modules | |
| keywords | Density | |
| keywords | Semiconductor wafers AND Equations | |
| tree | Journal of Electronic Packaging:;1995:;volume( 117 ):;issue: 002 | |
| contenttype | Fulltext |