Thermal Stress and Strain in Microelectronics PackagingSource: Journal of Electronic Packaging:;1993:;volume( 115 ):;issue: 003::page 343DOI: 10.1115/1.2909339Publisher: The American Society of Mechanical Engineers (ASME)keyword(s): Microelectronic packaging AND Thermal stresses ,
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contributor author | John H. Lau | |
contributor author | Peter A. Engel | |
date accessioned | 2017-05-08T23:40:59Z | |
date available | 2017-05-08T23:40:59Z | |
date copyright | September, 1993 | |
date issued | 1993 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26139#343_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/111748 | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Thermal Stress and Strain in Microelectronics Packaging | |
type | Journal Paper | |
journal volume | 115 | |
journal issue | 3 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.2909339 | |
journal fristpage | 343 | |
identifier eissn | 1043-7398 | |
keywords | Microelectronic packaging AND Thermal stresses | |
tree | Journal of Electronic Packaging:;1993:;volume( 115 ):;issue: 003 | |
contenttype | Fulltext |