Thermal Stress and Strain in Microelectronics Packaging
| contributor author | John H. Lau | |
| contributor author | Peter A. Engel | |
| date accessioned | 2017-05-08T23:40:59Z | |
| date available | 2017-05-08T23:40:59Z | |
| date copyright | September, 1993 | |
| date issued | 1993 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26139#343_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/111748 | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Thermal Stress and Strain in Microelectronics Packaging | |
| type | Journal Paper | |
| journal volume | 115 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2909339 | |
| journal fristpage | 343 | |
| identifier eissn | 1043-7398 | |
| keywords | Microelectronic packaging AND Thermal stresses | |
| tree | Journal of Electronic Packaging:;1993:;volume( 115 ):;issue: 003 | |
| contenttype | Fulltext |
