Handbook of Tape Automated BondingSource: Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 004::page 480DOI: 10.1115/1.2905486Publisher: The American Society of Mechanical Engineers (ASME)keyword(s): Bonding ,
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| contributor author | John H. Lau | |
| contributor author | William T. Chen | |
| date accessioned | 2017-05-08T23:38:03Z | |
| date available | 2017-05-08T23:38:03Z | |
| date copyright | December, 1992 | |
| date issued | 1992 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26133#480_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/110018 | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Handbook of Tape Automated Bonding | |
| type | Journal Paper | |
| journal volume | 114 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2905486 | |
| journal fristpage | 480 | |
| identifier eissn | 1043-7398 | |
| keywords | Bonding | |
| tree | Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 004 | |
| contenttype | Fulltext |