Journal of Electronic Packaging: Recent submissions
Now showing items 41-60 of 2086
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Virtual Testbed for Economical and Reliability Analysis of Battery Thermal Management Control Strategies1
(The American Society of Mechanical Engineers (ASME), 2024)A virtual testbed simulation framework is created for the economic, reliability, and lifetime analysis of battery thermal management control strategies in electric vehicles (EVs). The system-level model is created in the ... -
Electrically Conductive Adhesives in Microelectronics Packaging
(The American Society of Mechanical Engineers (ASME), 2024)Electronic packaging is integral to safeguarding electronic devices while ensuring electrical connectivity and heat dissipation. This paper reviews electrically conductive adhesives (ECAs), focusing on two main types: ... -
Thermal Spreading Resistance of Surface Adjacent Localized Heating-Induced Size Effects in Semiconductors
(The American Society of Mechanical Engineers (ASME), 2024)Localized heating is encountered in various scenarios, including the operation of transistors, light-emitting diodes, and some thermal spectroscopy techniques. When localized heating occurs on a scale comparable to the ... -
Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick Direct Bond Copper Substrates for Power Electronics
(The American Society of Mechanical Engineers (ASME), 2024)This study investigates the use of cold gas spraying (CGS) as a low-temperature additive manufacturing method to bond copper onto aluminum nitride (AlN) substrates for electronic packaging of high-power applications. While ... -
Liquid-to-Air Coolant Distribution Units Performance and Considerations for Server Rooms Upgrade With Conventional Air Conditioning
(The American Society of Mechanical Engineers (ASME), 2024)As web-based AI applications are growing rapidly, server rooms face escalating computational demands, prompting enterprises to either upgrade their facilities or outsource to co-located sites. This growth strains conventional ... -
Thermal-Hydraulic Characterization of a Thermosyphon Cooling System for Highly Compact Edge MicroDataCenter1
(The American Society of Mechanical Engineers (ASME), 2024)In the European project BRAINE, an extremely efficient passive thermosyphon cooling system was developed for a novel type of Edge MicroDataCenter (EMDC) with high heat fluxes to dissipate on individual computer cards and ... -
Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics
(The American Society of Mechanical Engineers (ASME), 2024)Convective heat transfer by jet impingement cooling offers a suitable solution for high heat flux applications. Compared to techniques that rely on bulk conduction in series with convection, direct liquid impingement reduces ... -
Acoustic Characterization of Integrated Circuits During Operation1
(The American Society of Mechanical Engineers (ASME), 2024)Power electronics are widely serving as core components of propulsion systems in electric vertical takeoff and landing (eVTOL) aircraft. Nevertheless, affected by the Paschen effect, the breakdown voltage of these electronics ... -
Performance Analysis of Liquid-to-Air Heat Exchanger of High-Power Density Racks
(The American Society of Mechanical Engineers (ASME), 2024)The ability of traditional room-conditioning systems to accommodate expanding information technology loads is limited in contemporary data centers (DCs), where the storage, storing, and processing of data have grown quickly ... -
Experimental and Numerical Investigation of Single-Phase Liquid Cooling for Heterogeneous Integration Multichip Module
(The American Society of Mechanical Engineers (ASME), 2024)The variety of new electronic packaging technologies has grown significantly over the last 20 years as a result of market demands for higher device performance at lower costs and in less space. Those demands have pushed ... -
Multiphysics Coupling in IGBT Modules: A Review
(The American Society of Mechanical Engineers (ASME), 2024)Since insulated gate bipolar transistor (IGBT) is a core component for power conversion in a power electronic system, guaranteeing the safety of IGBT becomes a crucial task for the maintenance of the power system. However, ... -
A Comparative Numerical Analysis of Cold Plates for Thermal Management of Chips With Hotspots
(The American Society of Mechanical Engineers (ASME), 2024)Thermal and hydraulic performances of seven water-cooled minichannel cold plates with different internal structures are compared using numerical analysis. Recent increasing demands for high-performance computing have led ... -
Effects of Thermal-Moisture Coupled Field on Delamination Behavior of Electronic Packaging
(The American Society of Mechanical Engineers (ASME), 2024)Delamination failure is one of the most prevalent and serious reliability issues in micro-electronic packaging. To understand this phenomenon further, this study constructs an experimental test system consisting of a double ... -
Simultaneous Characterization of Both Coefficients of Thermal Expansion and Thermal Warpages of Flip-Chip Packages With a Cap Using Strain Gauges
(The American Society of Mechanical Engineers (ASME), 2024)A relatively low-cost and easy-to-use strain gauge measurement is proposed here as an alternative method for simultaneously determining the thermally induced warpages and the coefficients of thermal expansion (CTEs) of the ... -
Hybrid Bonding for Ultra-High-Density Interconnect
(The American Society of Mechanical Engineers (ASME), 2024)Hybrid bonding is the technology for interchip ultrahigh-density interconnect at pitch smaller than 10 μm. The feasibility at wafer-to-wafer level bonding with bond pad pitch of sub-0.5 μm has been demonstrated with scaling ... -
The Research for Quickly Measuring the Diameter and Roundness of Solder Balls Based on Machine Vision Technology
(The American Society of Mechanical Engineers (ASME), 2023)Solder balls used in electronic packaging should have high dimensional and shape accuracy requirements to ensure the connection quality of solder balls during soldering. However, the existing solder ball detection methods ... -
Leadfree SnAgCu Solder Materials Characterization at High Strain Rates at Low Test Temperatures and Drop and Shock Simulation Using Input-G Method
(The American Society of Mechanical Engineers (ASME), 2023)Electronics will experience high and low working temperatures during operations, handling, and storage in severe environments applications such as download drilling, aircraft, and transportation. Temperatures in the vehicle ... -
Epoxy-Printed Circuit Board Interfacial Fracture Reliability Under Three-Point and Four-Point Bend Loading After Sustained Elevated Temperature Exposure1
(The American Society of Mechanical Engineers (ASME), 2024)The survivability and reliability of commercial electronic components under very high thermo-mechanical loads are improved using underfilling and potting methods. Potting protects from operating conditions such as moisture, ... -
Constant Strain-Rate Garofalo Creep Behavior of Intermediate 83Pb/10Sb/5Sn/2Ag and 91.5Sn/8.5Sb Solder Materials
(The American Society of Mechanical Engineers (ASME), 2024)Modern electronics reliability prediction models require materials-specific failure data across a range of conditions. Garofalo models are preferred due to their ability to accurately predict performance over a wide ... -
Modeling the Thermal-Compression Flip-Chip Process by Finite Element Analysis
(The American Society of Mechanical Engineers (ASME), 2024)For the first time, finite element analysis (FEA) is applied to the thermal-compression flip-chip process in micro-electronics. By adding the bump height nonuniformity and the morphology variance, a common basal line is ...