Journal of Electronic Packaging: Recent submissions
Now showing items 41-60 of 2074
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Effects of Thermal-Moisture Coupled Field on Delamination Behavior of Electronic Packaging
(The American Society of Mechanical Engineers (ASME), 2024)Delamination failure is one of the most prevalent and serious reliability issues in micro-electronic packaging. To understand this phenomenon further, this study constructs an experimental test system consisting of a double ... -
Simultaneous Characterization of Both Coefficients of Thermal Expansion and Thermal Warpages of Flip-Chip Packages With a Cap Using Strain Gauges
(The American Society of Mechanical Engineers (ASME), 2024)A relatively low-cost and easy-to-use strain gauge measurement is proposed here as an alternative method for simultaneously determining the thermally induced warpages and the coefficients of thermal expansion (CTEs) of the ... -
Hybrid Bonding for Ultra-High-Density Interconnect
(The American Society of Mechanical Engineers (ASME), 2024)Hybrid bonding is the technology for interchip ultrahigh-density interconnect at pitch smaller than 10 μm. The feasibility at wafer-to-wafer level bonding with bond pad pitch of sub-0.5 μm has been demonstrated with scaling ... -
The Research for Quickly Measuring the Diameter and Roundness of Solder Balls Based on Machine Vision Technology
(The American Society of Mechanical Engineers (ASME), 2023)Solder balls used in electronic packaging should have high dimensional and shape accuracy requirements to ensure the connection quality of solder balls during soldering. However, the existing solder ball detection methods ... -
Leadfree SnAgCu Solder Materials Characterization at High Strain Rates at Low Test Temperatures and Drop and Shock Simulation Using Input-G Method
(The American Society of Mechanical Engineers (ASME), 2023)Electronics will experience high and low working temperatures during operations, handling, and storage in severe environments applications such as download drilling, aircraft, and transportation. Temperatures in the vehicle ... -
Epoxy-Printed Circuit Board Interfacial Fracture Reliability Under Three-Point and Four-Point Bend Loading After Sustained Elevated Temperature Exposure1
(The American Society of Mechanical Engineers (ASME), 2024)The survivability and reliability of commercial electronic components under very high thermo-mechanical loads are improved using underfilling and potting methods. Potting protects from operating conditions such as moisture, ... -
Constant Strain-Rate Garofalo Creep Behavior of Intermediate 83Pb/10Sb/5Sn/2Ag and 91.5Sn/8.5Sb Solder Materials
(The American Society of Mechanical Engineers (ASME), 2024)Modern electronics reliability prediction models require materials-specific failure data across a range of conditions. Garofalo models are preferred due to their ability to accurately predict performance over a wide ... -
Modeling the Thermal-Compression Flip-Chip Process by Finite Element Analysis
(The American Society of Mechanical Engineers (ASME), 2024)For the first time, finite element analysis (FEA) is applied to the thermal-compression flip-chip process in micro-electronics. By adding the bump height nonuniformity and the morphology variance, a common basal line is ... -
Interface Reliability Modeling of Coaxial Through Silicon Via Based on WOA-BP Neural Network
(The American Society of Mechanical Engineers (ASME), 2024)Due to the complex structure and thermal mismatch of coaxial through silicon via (TSV), cracks easily occur under thermal load, leading to interface delamination or spalling failure. The reliability issue of coaxial TSV ... -
Research Status and Progress on Non-Destructive Testing Methods for Defect Inspection of Micro-Electronic Packaging
(The American Society of Mechanical Engineers (ASME), 2024)In a highly competitive and demanding micro-electronics market, non-destructive testing (NDT) technology has been widely applied to defect detection and evaluation of micro-electronic packaging. However, the trend of ... -
Printed Circuit Board Defect Image Recognition Based on the Multimodel Fusion Algorithm
(The American Society of Mechanical Engineers (ASME), 2023)Printed Circuit Board (PCB) is one of the most important components of electronic products. But the traditional defect detection methods are gradually difficult to meet the requirements of PCB defect detection. The research ... -
Numerical and Experimental Investigation of a Volumetric Resistance Blower Performance and Its Optimization for Portable Computing Device Applications
(The American Society of Mechanical Engineers (ASME), 2023)In this paper, we present our results on a relatively new kind of blower called Volumetric Resistance Blower (VRB) for cooling of portable computing platforms like laptop computers. The VRB performance was modeled numerically ... -
Automotive Silicon Carbide Power Module Cooling With a Novel Modular Manifold and Embedded Heat Sink
(The American Society of Mechanical Engineers (ASME), 2023)The next generation of integrated power electronics packages will implement wide-bandgap devices with ultrahigh device heat fluxes. Although jet impingement has received attention for power electronics thermal management, ... -
A Comprehensive Study on Characterization of Residual Stress of Build-Up Layer and Prediction of Chip Warpage
(The American Society of Mechanical Engineers (ASME), 2023)Better understanding and control of residual stress in the chip build-up layer are becoming more and more important for the assembly process. To estimate the chip warpage and characterize the residual stress, different ... -
Validation and Application of a Finned Tube Heat Exchanger Model for Rack-Level Cooling
(The American Society of Mechanical Engineers (ASME), 2023)A thermosyphon-based modular cooling approach offers an energy efficient cooling solution with an increased potential for waste heat recovery. Central to the cooling system is an air-refrigerant finned tube heat exchanger ... -
Publisher's Note: “Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation” (Cheng, H. C., and Liu, Y. C., 2023, ASME J. Electron. Packag.,145(2), p. 021005)
(The American Society of Mechanical Engineers (ASME), 2023)An error occurred in the school affiliation address of the authors. Taichung, Taiwan 407, China is incorrect. It should be Taichung, Taiwan 407. -
Optimal Design of Thermal Cycling Reliability for Plastic Ball Grid Array Assembly Via Finite Element Method and Taguchi Method
(The American Society of Mechanical Engineers (ASME), 2023)A finite element simulation analysis model was developed for a plastic ball grid array (PBGA) assembly to analyze its behavior under thermal cyclic loading conditions. The stress distribution in the SAC305 solder joints ... -
Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling
(The American Society of Mechanical Engineers (ASME), 5/15/2023 )Two-phase immersion cooling (2PIC) has been proposed as a means of economically increasing overall energy efficiency while accommodating increased chip powers and system-level power density. Designers unfamiliar with ... -
Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities
(The American Society of Mechanical Engineers (ASME), 12/9/2022 )Progress in the field of power electronics within electric vehicles has generally been driven by conventional engineering design principles and experiential learning. Power electronics is inherently a multidomain field ... -
A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique
(The American Society of Mechanical Engineers (ASME), 3/7/2023 1)The fatigue life prediction of the electronic packages under dynamic loading conditions is an increasingly important area of research, with direct application in packaging industries. Current life prediction methodologies ...