YaBeSH Engineering and Technology Library

    • Journals
    • PaperQuest
    • YSE Standards
    • YaBeSH
    • Login
    View Item 
    •   YE&T Library
    • ASME
    • Journal of Electronic Packaging
    • View Item
    •   YE&T Library
    • ASME
    • Journal of Electronic Packaging
    • View Item
    • All Fields
    • Source Title
    • Year
    • Publisher
    • Title
    • Subject
    • Author
    • DOI
    • ISBN
    Advanced Search
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Archive

    Acoustic Characterization of Integrated Circuits During Operation1

    Source: Journal of Electronic Packaging:;2024:;volume( 146 ):;issue: 004::page 41103-1
    Author:
    Frankhouse, Josef
    ,
    Li, Changgen
    ,
    Hu, Han
    DOI: 10.1115/1.4065649
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Power electronics are widely serving as core components of propulsion systems in electric vertical takeoff and landing (eVTOL) aircraft. Nevertheless, affected by the Paschen effect, the breakdown voltage of these electronics during flight is significantly lower than that on the ground, which could deteriorate system stability, or even cause aircraft faults or crashes, increasing safety risks for the public. As such, condition monitoring of power electronics has become critical for the safe operation of eVTOL. To achieve nonintrusive monitoring, acoustic emission (AE) sensors have gained traction with their prominent resistance to electromagnetic interference and high temperatures. However, existing studies yield conflicting results regarding whether an increase in loading voltage impacts the internal mechanical stress of electronics. To address this issue, we present this work to probe the existence and the pattern of a relationship between load voltage and stress wave, since the change of mechanical stress could generate acoustic waves that can be acquired by AE sensors. In this study, an AE sensor was applied onto an oscillator placed upon an epoxy substrate to characterize the acoustic waves emitted from the device under various input loads. In the experiment, we observed a unique AE signal pattern characterized by two distinct components that consistently intersect at a specific frequency. The time required to establish such intersections progressively lengthens as the load voltage increases. Through time-domain and frequency-domain analyses of the unique AE signals under different load voltages, it was discovered that certain features of the unique AE signals have an approximately linear relationship with the load voltage.
    • Download: (1.844Mb)
    • Show Full MetaData Hide Full MetaData
    • Get RIS
    • Item Order
    • Go To Publisher
    • Price: 5000 Rial
    • Statistics

      Acoustic Characterization of Integrated Circuits During Operation1

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/4302837
    Collections
    • Journal of Electronic Packaging

    Show full item record

    contributor authorFrankhouse, Josef
    contributor authorLi, Changgen
    contributor authorHu, Han
    date accessioned2024-12-24T18:50:09Z
    date available2024-12-24T18:50:09Z
    date copyright6/20/2024 12:00:00 AM
    date issued2024
    identifier issn1043-7398
    identifier otherep_146_04_041103.pdf
    identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4302837
    description abstractPower electronics are widely serving as core components of propulsion systems in electric vertical takeoff and landing (eVTOL) aircraft. Nevertheless, affected by the Paschen effect, the breakdown voltage of these electronics during flight is significantly lower than that on the ground, which could deteriorate system stability, or even cause aircraft faults or crashes, increasing safety risks for the public. As such, condition monitoring of power electronics has become critical for the safe operation of eVTOL. To achieve nonintrusive monitoring, acoustic emission (AE) sensors have gained traction with their prominent resistance to electromagnetic interference and high temperatures. However, existing studies yield conflicting results regarding whether an increase in loading voltage impacts the internal mechanical stress of electronics. To address this issue, we present this work to probe the existence and the pattern of a relationship between load voltage and stress wave, since the change of mechanical stress could generate acoustic waves that can be acquired by AE sensors. In this study, an AE sensor was applied onto an oscillator placed upon an epoxy substrate to characterize the acoustic waves emitted from the device under various input loads. In the experiment, we observed a unique AE signal pattern characterized by two distinct components that consistently intersect at a specific frequency. The time required to establish such intersections progressively lengthens as the load voltage increases. Through time-domain and frequency-domain analyses of the unique AE signals under different load voltages, it was discovered that certain features of the unique AE signals have an approximately linear relationship with the load voltage.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleAcoustic Characterization of Integrated Circuits During Operation1
    typeJournal Paper
    journal volume146
    journal issue4
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4065649
    journal fristpage41103-1
    journal lastpage41103-6
    page6
    treeJournal of Electronic Packaging:;2024:;volume( 146 ):;issue: 004
    contenttypeFulltext
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian