Journal of Electronic Packaging: Recent submissions
Now showing items 21-40 of 2080
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Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
(The American Society of Mechanical Engineers (ASME), 2024)Passive cooling through phase change materials (PCM) creates beneficial complimentary cooling techniques aimed at providing thermal gradient mitigation during device operation without additional power requirements. These ... -
Effect of Dispensing Type on Void Formation Using Convolutional Neural Network
(The American Society of Mechanical Engineers (ASME), 2024)Underfilling in flip chip packages is a critical component of reliability. This study utilized I-type, L-type, and U-type dispensing methods to address the issue, namely, voiding that creates empty spaces, which compromises ... -
Performance Analysis of a Brazed Plate Heat Exchanger During Condensation of R1233zd(E)
(The American Society of Mechanical Engineers (ASME), 2024)This paper focuses on the validation of a brazed plate heat exchanger (BPHE) model that acts as the condenser of a novel in-rack cooling loop. In the proposed system, the primary fluid enters as a saturated vapor, while ... -
Microbead Encapsulation for Protection of Electronic Components
(The American Society of Mechanical Engineers (ASME), 2025)This study investigates the application of microbeads as an innovative encapsulation technique to protect electronic components from harsh mechanical strain. Traditional encapsulation methods using hard epoxy provide ... -
A Kriging Surrogate Model for Ball Grid Array Electronic Packaging With Stochastic Material and Geometrical Parameters
(The American Society of Mechanical Engineers (ASME), 2024)Ball grid arrays (BGAs) offer significant advantages in the automotive industry, such as their small size and high integration density, making them a promising electronic packaging approach. However, the operating environment ... -
A Review of Mechanism and Technology of Hybrid Bonding
(The American Society of Mechanical Engineers (ASME), 2024)With the development of semiconductor technology, traditional flip-chip bonding has been difficult to meet the high-density, high-reliability requirements of advanced packaging technology. As an advanced three-dimensional ... -
Development of a Thermal Metrology Standard for Evaluation of Cold Plate Thermal Resistance as a Performance Metric
(The American Society of Mechanical Engineers (ASME), 2024)A significant number of investigations have been performed to develop and optimize cold plates for direct-to-chip cooling of processor packages. Many investigations have reported computational simulations using commercially ... -
Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers
(The American Society of Mechanical Engineers (ASME), 2024)Demand is growing for the dense and high-performing IT computing capacity to support artificial intelligence, deep learning, machine learning, autonomous cars, the Internet of Things, etc. This led to an unprecedented ... -
Process Recipe and Functional Circuitry Performance on Aerosol Jet Printed Water-Based Silver Ink
(The American Society of Mechanical Engineers (ASME), 2024)The demand for compact, lightweight, and stretchable printed electric circuits has increased with the advancement of flexible printing technology in electronics. The viability of environmentally friendly water-based inks ... -
Thermal Property Estimation of Thin-Layered Structures by Means of Thermoreflectance Measurement and Network Identification by Deconvolution Algorithm
(The American Society of Mechanical Engineers (ASME), 2024)Laser-induced forward transfer (LIFT) is a powerful tool for micro and nanoscale digital printing of metals for electronic packaging. In the metal LIFT process, the donor thin metal film is propelled to the receiving ... -
Reliability Assessment and Multiphysics Simulation of Additively Printed Wearable Humidity Sensor With Supercapacitive Material for Astronaut in Extreme Condition
(The American Society of Mechanical Engineers (ASME), 2024)Additive technologies, such as aerosol jet printing (AJP) and direct write printing, are increasingly being used in the production of printed circuit boards because they eliminate the need for costly tooling, such as ... -
Electrochemical Additive Manufacturing-Based Design of a Heat Sink for Single-Phase Natural Convection Immersion Cooling Application
(The American Society of Mechanical Engineers (ASME), 2024)To fulfill the increasing data processing demands within modern data centers, a corresponding increase in server performance is necessary. This leads to subsequent increases in power consumption and heat generation in the ... -
Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core
(The American Society of Mechanical Engineers (ASME), 2024)The data center's server power density and heat generation have increased exponentially because of the recent, unparalleled rise in the processing and storing of massive amounts of data on a regular basis. One-third of the ... -
Convection Cooling of Power Electronics Operating in Deep-Space
(The American Society of Mechanical Engineers (ASME), 2024)Since most traditional spacecrafts are designed to operate in a vacuum environment, forced convection cooling has seen limited use in space-applications. This paper considers an ideal candidate—the Dragonfly Lander, a ... -
Virtual Testbed for Economical and Reliability Analysis of Battery Thermal Management Control Strategies1
(The American Society of Mechanical Engineers (ASME), 2024)A virtual testbed simulation framework is created for the economic, reliability, and lifetime analysis of battery thermal management control strategies in electric vehicles (EVs). The system-level model is created in the ... -
Electrically Conductive Adhesives in Microelectronics Packaging
(The American Society of Mechanical Engineers (ASME), 2024)Electronic packaging is integral to safeguarding electronic devices while ensuring electrical connectivity and heat dissipation. This paper reviews electrically conductive adhesives (ECAs), focusing on two main types: ... -
Thermal Spreading Resistance of Surface Adjacent Localized Heating-Induced Size Effects in Semiconductors
(The American Society of Mechanical Engineers (ASME), 2024)Localized heating is encountered in various scenarios, including the operation of transistors, light-emitting diodes, and some thermal spectroscopy techniques. When localized heating occurs on a scale comparable to the ... -
Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick Direct Bond Copper Substrates for Power Electronics
(The American Society of Mechanical Engineers (ASME), 2024)This study investigates the use of cold gas spraying (CGS) as a low-temperature additive manufacturing method to bond copper onto aluminum nitride (AlN) substrates for electronic packaging of high-power applications. While ... -
Liquid-to-Air Coolant Distribution Units Performance and Considerations for Server Rooms Upgrade With Conventional Air Conditioning
(The American Society of Mechanical Engineers (ASME), 2024)As web-based AI applications are growing rapidly, server rooms face escalating computational demands, prompting enterprises to either upgrade their facilities or outsource to co-located sites. This growth strains conventional ... -
Thermal-Hydraulic Characterization of a Thermosyphon Cooling System for Highly Compact Edge MicroDataCenter1
(The American Society of Mechanical Engineers (ASME), 2024)In the European project BRAINE, an extremely efficient passive thermosyphon cooling system was developed for a novel type of Edge MicroDataCenter (EMDC) with high heat fluxes to dissipate on individual computer cards and ...