Journal of Electronic Packaging: Recent submissions
Now showing items 21-40 of 2074
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Development of a Thermal Metrology Standard for Evaluation of Cold Plate Thermal Resistance as a Performance Metric
(The American Society of Mechanical Engineers (ASME), 2024)A significant number of investigations have been performed to develop and optimize cold plates for direct-to-chip cooling of processor packages. Many investigations have reported computational simulations using commercially ... -
Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers
(The American Society of Mechanical Engineers (ASME), 2024)Demand is growing for the dense and high-performing IT computing capacity to support artificial intelligence, deep learning, machine learning, autonomous cars, the Internet of Things, etc. This led to an unprecedented ... -
Process Recipe and Functional Circuitry Performance on Aerosol Jet Printed Water-Based Silver Ink
(The American Society of Mechanical Engineers (ASME), 2024)The demand for compact, lightweight, and stretchable printed electric circuits has increased with the advancement of flexible printing technology in electronics. The viability of environmentally friendly water-based inks ... -
Thermal Property Estimation of Thin-Layered Structures by Means of Thermoreflectance Measurement and Network Identification by Deconvolution Algorithm
(The American Society of Mechanical Engineers (ASME), 2024)Laser-induced forward transfer (LIFT) is a powerful tool for micro and nanoscale digital printing of metals for electronic packaging. In the metal LIFT process, the donor thin metal film is propelled to the receiving ... -
Reliability Assessment and Multiphysics Simulation of Additively Printed Wearable Humidity Sensor With Supercapacitive Material for Astronaut in Extreme Condition
(The American Society of Mechanical Engineers (ASME), 2024)Additive technologies, such as aerosol jet printing (AJP) and direct write printing, are increasingly being used in the production of printed circuit boards because they eliminate the need for costly tooling, such as ... -
Electrochemical Additive Manufacturing-Based Design of a Heat Sink for Single-Phase Natural Convection Immersion Cooling Application
(The American Society of Mechanical Engineers (ASME), 2024)To fulfill the increasing data processing demands within modern data centers, a corresponding increase in server performance is necessary. This leads to subsequent increases in power consumption and heat generation in the ... -
Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core
(The American Society of Mechanical Engineers (ASME), 2024)The data center's server power density and heat generation have increased exponentially because of the recent, unparalleled rise in the processing and storing of massive amounts of data on a regular basis. One-third of the ... -
Convection Cooling of Power Electronics Operating in Deep-Space
(The American Society of Mechanical Engineers (ASME), 2024)Since most traditional spacecrafts are designed to operate in a vacuum environment, forced convection cooling has seen limited use in space-applications. This paper considers an ideal candidate—the Dragonfly Lander, a ... -
Virtual Testbed for Economical and Reliability Analysis of Battery Thermal Management Control Strategies1
(The American Society of Mechanical Engineers (ASME), 2024)A virtual testbed simulation framework is created for the economic, reliability, and lifetime analysis of battery thermal management control strategies in electric vehicles (EVs). The system-level model is created in the ... -
Electrically Conductive Adhesives in Microelectronics Packaging
(The American Society of Mechanical Engineers (ASME), 2024)Electronic packaging is integral to safeguarding electronic devices while ensuring electrical connectivity and heat dissipation. This paper reviews electrically conductive adhesives (ECAs), focusing on two main types: ... -
Thermal Spreading Resistance of Surface Adjacent Localized Heating-Induced Size Effects in Semiconductors
(The American Society of Mechanical Engineers (ASME), 2024)Localized heating is encountered in various scenarios, including the operation of transistors, light-emitting diodes, and some thermal spectroscopy techniques. When localized heating occurs on a scale comparable to the ... -
Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick Direct Bond Copper Substrates for Power Electronics
(The American Society of Mechanical Engineers (ASME), 2024)This study investigates the use of cold gas spraying (CGS) as a low-temperature additive manufacturing method to bond copper onto aluminum nitride (AlN) substrates for electronic packaging of high-power applications. While ... -
Liquid-to-Air Coolant Distribution Units Performance and Considerations for Server Rooms Upgrade With Conventional Air Conditioning
(The American Society of Mechanical Engineers (ASME), 2024)As web-based AI applications are growing rapidly, server rooms face escalating computational demands, prompting enterprises to either upgrade their facilities or outsource to co-located sites. This growth strains conventional ... -
Thermal-Hydraulic Characterization of a Thermosyphon Cooling System for Highly Compact Edge MicroDataCenter1
(The American Society of Mechanical Engineers (ASME), 2024)In the European project BRAINE, an extremely efficient passive thermosyphon cooling system was developed for a novel type of Edge MicroDataCenter (EMDC) with high heat fluxes to dissipate on individual computer cards and ... -
Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics
(The American Society of Mechanical Engineers (ASME), 2024)Convective heat transfer by jet impingement cooling offers a suitable solution for high heat flux applications. Compared to techniques that rely on bulk conduction in series with convection, direct liquid impingement reduces ... -
Acoustic Characterization of Integrated Circuits During Operation1
(The American Society of Mechanical Engineers (ASME), 2024)Power electronics are widely serving as core components of propulsion systems in electric vertical takeoff and landing (eVTOL) aircraft. Nevertheless, affected by the Paschen effect, the breakdown voltage of these electronics ... -
Performance Analysis of Liquid-to-Air Heat Exchanger of High-Power Density Racks
(The American Society of Mechanical Engineers (ASME), 2024)The ability of traditional room-conditioning systems to accommodate expanding information technology loads is limited in contemporary data centers (DCs), where the storage, storing, and processing of data have grown quickly ... -
Experimental and Numerical Investigation of Single-Phase Liquid Cooling for Heterogeneous Integration Multichip Module
(The American Society of Mechanical Engineers (ASME), 2024)The variety of new electronic packaging technologies has grown significantly over the last 20 years as a result of market demands for higher device performance at lower costs and in less space. Those demands have pushed ... -
Multiphysics Coupling in IGBT Modules: A Review
(The American Society of Mechanical Engineers (ASME), 2024)Since insulated gate bipolar transistor (IGBT) is a core component for power conversion in a power electronic system, guaranteeing the safety of IGBT becomes a crucial task for the maintenance of the power system. However, ... -
A Comparative Numerical Analysis of Cold Plates for Thermal Management of Chips With Hotspots
(The American Society of Mechanical Engineers (ASME), 2024)Thermal and hydraulic performances of seven water-cooled minichannel cold plates with different internal structures are compared using numerical analysis. Recent increasing demands for high-performance computing have led ...