Journal of Electronic Packaging: Recent submissions
Now showing items 21-40 of 2086
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Experimental Method to Measure High-Temperature Hygroscopic Swelling in Epoxy Mold Compounds and Dielectric Build-Up Films
(The American Society of Mechanical Engineers (ASME), 2024)In this study, high-temperature hygroscopic swelling characterization of different epoxy mold compounds (EMCs) and dielectric build-up films (DBFs) were analyzed using an experimental technique. The approach maintains ... -
Behavior of Polymeric Substrates and Sintered Silver Printed Hybrid Electronic Assemblies Subject to Extreme Acceleration Levels and Elevated Temperatures
(The American Society of Mechanical Engineers (ASME), 2024)This paper focuses on the response of printed hybrid electronic (PHE) assemblies with polymeric substrates and additively manufactured sintered silver electrical traces subject to extreme mechanical shocks (up to 100,000 g) ... -
Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes
(The American Society of Mechanical Engineers (ASME), 2024)Sintered silver is a popular material for printing conductive traces in printed hybrid electronics (PHE). However, due to the novel materials and printing techniques in PHEs, reliability still needs to be adequately ... -
Application of the Nonlinear Fracture Mechanics Parameter ΔT* to Wire-Liftoff Lifetime Estimation of Power Modules at Elevated Temperatures
(The American Society of Mechanical Engineers (ASME), 2024)Power modules are utilized to control electric power and play a key role in the systems for energy conversion. One of the reliability problems in power modules is the wire-liftoff, in which an aluminum wire delaminates ... -
Incorporating Tensile Stress Into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints
(The American Society of Mechanical Engineers (ASME), 2024)Accelerated testing has been executed to examine the combined influence of electromigration (EM) stressors (elevated current density and elevated ambient temperature) and tensile stress on the lifetime of SAC305 solder ... -
Wideband Equivalent Circuit Modeling and Parameter Extraction Method for Through Via in Ceramic Package Substrate
(The American Society of Mechanical Engineers (ASME), 2024)There are numbers of through ceramic vias (TCVs) in ceramic package substrates for vertical interconnection of signal, and it would be very difficult, even impossible, to create the full-wave three-dimensional (3D) model ... -
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
(The American Society of Mechanical Engineers (ASME), 2024)Passive cooling through phase change materials (PCM) creates beneficial complimentary cooling techniques aimed at providing thermal gradient mitigation during device operation without additional power requirements. These ... -
Effect of Dispensing Type on Void Formation Using Convolutional Neural Network
(The American Society of Mechanical Engineers (ASME), 2024)Underfilling in flip chip packages is a critical component of reliability. This study utilized I-type, L-type, and U-type dispensing methods to address the issue, namely, voiding that creates empty spaces, which compromises ... -
Performance Analysis of a Brazed Plate Heat Exchanger During Condensation of R1233zd(E)
(The American Society of Mechanical Engineers (ASME), 2024)This paper focuses on the validation of a brazed plate heat exchanger (BPHE) model that acts as the condenser of a novel in-rack cooling loop. In the proposed system, the primary fluid enters as a saturated vapor, while ... -
Microbead Encapsulation for Protection of Electronic Components
(The American Society of Mechanical Engineers (ASME), 2025)This study investigates the application of microbeads as an innovative encapsulation technique to protect electronic components from harsh mechanical strain. Traditional encapsulation methods using hard epoxy provide ... -
A Kriging Surrogate Model for Ball Grid Array Electronic Packaging With Stochastic Material and Geometrical Parameters
(The American Society of Mechanical Engineers (ASME), 2024)Ball grid arrays (BGAs) offer significant advantages in the automotive industry, such as their small size and high integration density, making them a promising electronic packaging approach. However, the operating environment ... -
A Review of Mechanism and Technology of Hybrid Bonding
(The American Society of Mechanical Engineers (ASME), 2024)With the development of semiconductor technology, traditional flip-chip bonding has been difficult to meet the high-density, high-reliability requirements of advanced packaging technology. As an advanced three-dimensional ... -
Development of a Thermal Metrology Standard for Evaluation of Cold Plate Thermal Resistance as a Performance Metric
(The American Society of Mechanical Engineers (ASME), 2024)A significant number of investigations have been performed to develop and optimize cold plates for direct-to-chip cooling of processor packages. Many investigations have reported computational simulations using commercially ... -
Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers
(The American Society of Mechanical Engineers (ASME), 2024)Demand is growing for the dense and high-performing IT computing capacity to support artificial intelligence, deep learning, machine learning, autonomous cars, the Internet of Things, etc. This led to an unprecedented ... -
Process Recipe and Functional Circuitry Performance on Aerosol Jet Printed Water-Based Silver Ink
(The American Society of Mechanical Engineers (ASME), 2024)The demand for compact, lightweight, and stretchable printed electric circuits has increased with the advancement of flexible printing technology in electronics. The viability of environmentally friendly water-based inks ... -
Thermal Property Estimation of Thin-Layered Structures by Means of Thermoreflectance Measurement and Network Identification by Deconvolution Algorithm
(The American Society of Mechanical Engineers (ASME), 2024)Laser-induced forward transfer (LIFT) is a powerful tool for micro and nanoscale digital printing of metals for electronic packaging. In the metal LIFT process, the donor thin metal film is propelled to the receiving ... -
Reliability Assessment and Multiphysics Simulation of Additively Printed Wearable Humidity Sensor With Supercapacitive Material for Astronaut in Extreme Condition
(The American Society of Mechanical Engineers (ASME), 2024)Additive technologies, such as aerosol jet printing (AJP) and direct write printing, are increasingly being used in the production of printed circuit boards because they eliminate the need for costly tooling, such as ... -
Electrochemical Additive Manufacturing-Based Design of a Heat Sink for Single-Phase Natural Convection Immersion Cooling Application
(The American Society of Mechanical Engineers (ASME), 2024)To fulfill the increasing data processing demands within modern data centers, a corresponding increase in server performance is necessary. This leads to subsequent increases in power consumption and heat generation in the ... -
Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core
(The American Society of Mechanical Engineers (ASME), 2024)The data center's server power density and heat generation have increased exponentially because of the recent, unparalleled rise in the processing and storing of massive amounts of data on a regular basis. One-third of the ... -
Convection Cooling of Power Electronics Operating in Deep-Space
(The American Society of Mechanical Engineers (ASME), 2024)Since most traditional spacecrafts are designed to operate in a vacuum environment, forced convection cooling has seen limited use in space-applications. This paper considers an ideal candidate—the Dragonfly Lander, a ...