YaBeSH Engineering and Technology Library

    • Journals
    • PaperQuest
    • YSE Standards
    • YaBeSH
    • Login
    View Item 
    •   YE&T Library
    • ASME
    • Journal of Electronic Packaging
    • View Item
    •   YE&T Library
    • ASME
    • Journal of Electronic Packaging
    • View Item
    • All Fields
    • Source Title
    • Year
    • Publisher
    • Title
    • Subject
    • Author
    • DOI
    • ISBN
    Advanced Search
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Archive

    Reliability Assessment and Multiphysics Simulation of Additively Printed Wearable Humidity Sensor With Supercapacitive Material for Astronaut in Extreme Condition

    Source: Journal of Electronic Packaging:;2024:;volume( 146 ):;issue: 004::page 41114-1
    Author:
    Lall, Pradeep
    ,
    Jang, Hyesoo
    ,
    Hill, Curtis
    DOI: 10.1115/1.4065940
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Additive technologies, such as aerosol jet printing (AJP) and direct write printing, are increasingly being used in the production of printed circuit boards because they eliminate the need for costly tooling, such as photomasks or etching containers. This is because additive methods allow for the direct deposition of printing materials onto a substrate. A design and manufacturing approach based on software also enables production flexibility, as well as speedier tool adjustments and design development. Moreover, additive printing methods could be used on a wide range of materials, including fabrics, vehicles, and polymers with various surfaces and forms. This versatility in a broad variety of applications allows engineers to create diverse applications, such as sensing devices with electro-cardiogram sensors, pulse-oxygen sensors, galvanic skin response sensors, body temperature sensors, humidity sensors, and so on. Due to its potential for adaptability and integration, the development of additively printed humidity sensors has been the subject of several prior investigations. There are still issues with the reliability of current humidity sensor technology when flexing force is coupled with the humidity sensor. For the avoidance of stability issues, it is required to develop a better printing technique, process recipe, and sensing material encapsulation. In this research, the direct-write (D-write) printing approach with an nScrypt printer was employed to print the humidity sensor as a test vehicle in a laboratory setting. The sensor was characterized by analyzing the print recipe and its interaction with humidity in regard to resistance and humidity sensitivity. Additionally, the characterization of sensor accuracy, hysteresis, linearity, and stability in relation to temperature and humidity variation has been measured. Furthermore, a multiphysics simulation model was created in order to comprehend the electrochemical processes that occur when the humidity sensor is exposed to a very humid environment.
    • Download: (4.796Mb)
    • Show Full MetaData Hide Full MetaData
    • Get RIS
    • Item Order
    • Go To Publisher
    • Price: 5000 Rial
    • Statistics

      Reliability Assessment and Multiphysics Simulation of Additively Printed Wearable Humidity Sensor With Supercapacitive Material for Astronaut in Extreme Condition

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/4302849
    Collections
    • Journal of Electronic Packaging

    Show full item record

    contributor authorLall, Pradeep
    contributor authorJang, Hyesoo
    contributor authorHill, Curtis
    date accessioned2024-12-24T18:50:32Z
    date available2024-12-24T18:50:32Z
    date copyright8/17/2024 12:00:00 AM
    date issued2024
    identifier issn1043-7398
    identifier otherep_146_04_041114.pdf
    identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4302849
    description abstractAdditive technologies, such as aerosol jet printing (AJP) and direct write printing, are increasingly being used in the production of printed circuit boards because they eliminate the need for costly tooling, such as photomasks or etching containers. This is because additive methods allow for the direct deposition of printing materials onto a substrate. A design and manufacturing approach based on software also enables production flexibility, as well as speedier tool adjustments and design development. Moreover, additive printing methods could be used on a wide range of materials, including fabrics, vehicles, and polymers with various surfaces and forms. This versatility in a broad variety of applications allows engineers to create diverse applications, such as sensing devices with electro-cardiogram sensors, pulse-oxygen sensors, galvanic skin response sensors, body temperature sensors, humidity sensors, and so on. Due to its potential for adaptability and integration, the development of additively printed humidity sensors has been the subject of several prior investigations. There are still issues with the reliability of current humidity sensor technology when flexing force is coupled with the humidity sensor. For the avoidance of stability issues, it is required to develop a better printing technique, process recipe, and sensing material encapsulation. In this research, the direct-write (D-write) printing approach with an nScrypt printer was employed to print the humidity sensor as a test vehicle in a laboratory setting. The sensor was characterized by analyzing the print recipe and its interaction with humidity in regard to resistance and humidity sensitivity. Additionally, the characterization of sensor accuracy, hysteresis, linearity, and stability in relation to temperature and humidity variation has been measured. Furthermore, a multiphysics simulation model was created in order to comprehend the electrochemical processes that occur when the humidity sensor is exposed to a very humid environment.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleReliability Assessment and Multiphysics Simulation of Additively Printed Wearable Humidity Sensor With Supercapacitive Material for Astronaut in Extreme Condition
    typeJournal Paper
    journal volume146
    journal issue4
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4065940
    journal fristpage41114-1
    journal lastpage41114-10
    page10
    treeJournal of Electronic Packaging:;2024:;volume( 146 ):;issue: 004
    contenttypeFulltext
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian