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    Electrochemical Additive Manufacturing-Based Design of a Heat Sink for Single-Phase Natural Convection Immersion Cooling Application

    Source: Journal of Electronic Packaging:;2024:;volume( 146 ):;issue: 004::page 41113-1
    Author:
    Lamotte-Dawaghreh, Jacob
    ,
    Herring, Joseph
    ,
    Pundla, Sai Abhideep
    ,
    Suthar, Rohit
    ,
    Nair, Vivek
    ,
    Bansode, Pratik
    ,
    Gupta, Gautam
    ,
    Agonafer, Dereje
    ,
    Madril, Joseph
    ,
    Ouradnik, Tim
    ,
    Matthews, Michael
    ,
    Winfield, Ian
    DOI: 10.1115/1.4065987
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: To fulfill the increasing data processing demands within modern data centers, a corresponding increase in server performance is necessary. This leads to subsequent increases in power consumption and heat generation in the servers due to high-performance processing units. Currently, air cooling is the most widely used thermal management technique in data centers, but it has started to reach its limitations in cooling of high-power density packaging. Therefore, industries utilizing data centers are looking to single-phase immersion cooling to reduce the operational and cooling costs by enhancing the thermal management of servers. In this study, heat sinks with triply periodic minimal surface (TPMS) lattice structures were designed for application in single-phase immersion cooling of data center servers. These designs are made possible by electrochemical additive manufacturing (AM) technology due to their complex topologies. The electrochemical additive manufacturing process allows for generation of complex heat sink geometries not possible using traditional manufacturing processes. Geometric complexities including amorphous and porous structures with high surface area to volume ratio enable electrochemical additive manufacturing heat sinks to have superior heat transfer properties. Our objective is to compare various heat sink geometries by minimizing max case temperature in a single-phase immersion cooling setup for a natural convection setup. Computational fluid dynamics in ansysfluent is utilized to compare the electrochemical additive manufacturing heat sink designs. The additively manufactured heat sink designs are evaluated by comparing their thermal performance under natural convection conditions. This study presents a novel approach to heat sink design and bolsters the capability of electrochemical additive manufacturing-produced heat sinks.
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      Electrochemical Additive Manufacturing-Based Design of a Heat Sink for Single-Phase Natural Convection Immersion Cooling Application

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    http://yetl.yabesh.ir/yetl1/handle/yetl/4302848
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    contributor authorLamotte-Dawaghreh, Jacob
    contributor authorHerring, Joseph
    contributor authorPundla, Sai Abhideep
    contributor authorSuthar, Rohit
    contributor authorNair, Vivek
    contributor authorBansode, Pratik
    contributor authorGupta, Gautam
    contributor authorAgonafer, Dereje
    contributor authorMadril, Joseph
    contributor authorOuradnik, Tim
    contributor authorMatthews, Michael
    contributor authorWinfield, Ian
    date accessioned2024-12-24T18:50:30Z
    date available2024-12-24T18:50:30Z
    date copyright8/9/2024 12:00:00 AM
    date issued2024
    identifier issn1043-7398
    identifier otherep_146_04_041113.pdf
    identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4302848
    description abstractTo fulfill the increasing data processing demands within modern data centers, a corresponding increase in server performance is necessary. This leads to subsequent increases in power consumption and heat generation in the servers due to high-performance processing units. Currently, air cooling is the most widely used thermal management technique in data centers, but it has started to reach its limitations in cooling of high-power density packaging. Therefore, industries utilizing data centers are looking to single-phase immersion cooling to reduce the operational and cooling costs by enhancing the thermal management of servers. In this study, heat sinks with triply periodic minimal surface (TPMS) lattice structures were designed for application in single-phase immersion cooling of data center servers. These designs are made possible by electrochemical additive manufacturing (AM) technology due to their complex topologies. The electrochemical additive manufacturing process allows for generation of complex heat sink geometries not possible using traditional manufacturing processes. Geometric complexities including amorphous and porous structures with high surface area to volume ratio enable electrochemical additive manufacturing heat sinks to have superior heat transfer properties. Our objective is to compare various heat sink geometries by minimizing max case temperature in a single-phase immersion cooling setup for a natural convection setup. Computational fluid dynamics in ansysfluent is utilized to compare the electrochemical additive manufacturing heat sink designs. The additively manufactured heat sink designs are evaluated by comparing their thermal performance under natural convection conditions. This study presents a novel approach to heat sink design and bolsters the capability of electrochemical additive manufacturing-produced heat sinks.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleElectrochemical Additive Manufacturing-Based Design of a Heat Sink for Single-Phase Natural Convection Immersion Cooling Application
    typeJournal Paper
    journal volume146
    journal issue4
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4065987
    journal fristpage41113-1
    journal lastpage41113-8
    page8
    treeJournal of Electronic Packaging:;2024:;volume( 146 ):;issue: 004
    contenttypeFulltext
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