Search
CSV
RISA Nonlinear Multi-Domain Stress Analysis Method for Surface-Mount Solder Joints
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Solder joint fatigue failures are a potential reliability hazard in surface-mount electronic packages under cyclic thermal loading environment. Proper design and reliability assessment are thus ...
Simulation of the Influence of Manufacturing Quality on Reliability of Vias
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Techniques based on physics-of-failure principles are fairly well established for mechanical design of electronic packages. This paper provides an example where such techniques can also be exploited ...
Reliability Issues in Plated-Through-Holes Due to Insertion-Mount Compliant-Pin Connectors
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Stresses arising in plated through holes (PTHs) and surrounding printed wiring board (PWB) substrates due to pin forces of insertion-mount compliant-pin connectors are modeled analytically. The ...
A Nonlinear Multi-Domain Thermomechanical Stress Analysis Method for Surface-Mount Solder Joints—Part II: Viscoplastic Analysis
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This is part II of a two-part paper presented by the authors for thermomechanical stress analysis of surface mount interconnects. A generalized multi-domain Rayleigh Ritz (MDRR) stress analysis ...
Prediction of Electrical Properties of Plain-Weave Fabric Composites for Printed Wiring Board Design
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A mechanistic model is presented for predicting the effective dielectric constant and loss tangent of woven-fabric reinforced composites with low-loss constituents. A two-scale asymptotic homogenization ...
Dynamics and Nonlinear Coordination Control of Multifingered Mechanical Hands
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper presents a study of the dynamics and nonlinear coordination control of multifingered mechanical hands. Considering the dynamics of the object and the fingers, the equations of motion ...
Effective Thermomechanical Behavior of Plain-Weave Fabric-Reinforced Composites Using Homogenization Theory
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A micromechanical analysis is presented to obtain the effective macroscale orthotropic thermomechanical behavior of plain-weave fabric reinforced laminated composites based on a two-scale asymptotic ...
A Numerical Study of Fatigue Life of J-Leaded Solder Joints Using the Energy Partitioning Approach
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A surface-mount J-leaded device is modeled in this study, to investigate the effects of selected design, loading and manufacturing variables on solder joint fatigue life. The solder is modeled ...
Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 1—Without Underfill
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A generalized multi-domain Rayleigh-Ritz (MDRR) approach developed by Ling and Dasgupta (1995), is extended in this paper, to obtain the stress field in flip chip solder interconnects, under ...
Stress Analysis of Surface-Mount Interconnections Due to Vibrational Loading
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Recently, accelerated testing of surface mount interconnects under combined temperature and vibration environments has been recognized to be a necessary activity to ensure enhanced test-time ...