contributor author | K. Darbha | |
contributor author | J. H. Okura | |
contributor author | A. Dasgupta | |
date accessioned | 2017-05-08T23:59:19Z | |
date available | 2017-05-08T23:59:19Z | |
date copyright | December, 1999 | |
date issued | 1999 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26175#231_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/121977 | |
description abstract | A generalized multi-domain Rayleigh-Ritz (MDRR) approach developed by Ling and Dasgupta (1995), is extended in this paper, to obtain the stress field in flip chip solder interconnects, under cyclic thermal loading. Elastic, Plastic and time-dependent visco-plastic analysis is demonstrated on flip chip solder interconnects. The method has been applied to other surface-mount interconnects in the past such as J-lead (Ling and Dasgupta, 1996a) and ball-grid joints (Ling and Dasgupta, 1997). The analysis results for the J-lead and ball grid joints have confirmed that the MDRR technique is capable of providing stress-strain hysteresis with adequate accuracy, at a fraction of the modeling effort required for finite element model generation and analyses. Nonlinear viscoplastic stress analysis results for flip chip interconnects without underfill are presented in this paper. The fatigue endurance of the solder joints is assessed by combining results from this stress analysis model with an energy-partitioning damage model (Dasgupta et al., 1992). The life predicted by the analytical damage model is compared with experimental results. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 1—Without Underfill | |
type | Journal Paper | |
journal volume | 121 | |
journal issue | 4 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.2793845 | |
journal fristpage | 231 | |
journal lastpage | 236 | |
identifier eissn | 1043-7398 | |
keywords | Durability | |
keywords | Solders | |
keywords | Flip-chip | |
keywords | Stress | |
keywords | Stress analysis (Engineering) | |
keywords | Fatigue | |
keywords | Modeling | |
keywords | Finite element model | |
keywords | Solder joints AND Surface mount packaging | |
tree | Journal of Electronic Packaging:;1999:;volume( 121 ):;issue: 004 | |
contenttype | Fulltext | |