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    Simulation of the Influence of Manufacturing Quality on Reliability of Vias

    Source: Journal of Electronic Packaging:;1995:;volume( 117 ):;issue: 002::page 141
    Author:
    A. Dasgupta
    ,
    V. Ramappan
    DOI: 10.1115/1.2792081
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Techniques based on physics-of-failure principles are fairly well established for mechanical design of electronic packages. This paper provides an example where such techniques can also be exploited to develop guidelines for assessment of manufacturing quality and its impact on reliability. As a case study, this study examines the influence of plating waviness in vias and Plated Through Holes (PTH), on reliability during solder reflow cycles and during subsequent operational thermal cycling. The stress analysis is performed with elastic-plastic finite element models which are seeded with various levels of plating waviness defects. Sensitivity analysis is done with factorial parametric simulation studies based on Design of Experiment (DOE) methods. Buckling and fatigue failure models are used to establish inspection criteria for acceptable thresholds of plating waviness.
    keyword(s): Simulation , Manufacturing , Reliability , Plating , Physics , Inspection , Product quality , Stress analysis (Engineering) , Design , Design engineering , Buckling , Cycles , Failure , Finite element model , Reflow soldering , Sensitivity analysis , Fatigue failure AND Electronic packages ,
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      Simulation of the Influence of Manufacturing Quality on Reliability of Vias

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    http://yetl.yabesh.ir/yetl1/handle/yetl/115162
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    • Journal of Electronic Packaging

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    contributor authorA. Dasgupta
    contributor authorV. Ramappan
    date accessioned2017-05-08T23:46:55Z
    date available2017-05-08T23:46:55Z
    date copyrightJune, 1995
    date issued1995
    identifier issn1528-9044
    identifier otherJEPAE4-26149#141_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/115162
    description abstractTechniques based on physics-of-failure principles are fairly well established for mechanical design of electronic packages. This paper provides an example where such techniques can also be exploited to develop guidelines for assessment of manufacturing quality and its impact on reliability. As a case study, this study examines the influence of plating waviness in vias and Plated Through Holes (PTH), on reliability during solder reflow cycles and during subsequent operational thermal cycling. The stress analysis is performed with elastic-plastic finite element models which are seeded with various levels of plating waviness defects. Sensitivity analysis is done with factorial parametric simulation studies based on Design of Experiment (DOE) methods. Buckling and fatigue failure models are used to establish inspection criteria for acceptable thresholds of plating waviness.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleSimulation of the Influence of Manufacturing Quality on Reliability of Vias
    typeJournal Paper
    journal volume117
    journal issue2
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2792081
    journal fristpage141
    journal lastpage146
    identifier eissn1043-7398
    keywordsSimulation
    keywordsManufacturing
    keywordsReliability
    keywordsPlating
    keywordsPhysics
    keywordsInspection
    keywordsProduct quality
    keywordsStress analysis (Engineering)
    keywordsDesign
    keywordsDesign engineering
    keywordsBuckling
    keywordsCycles
    keywordsFailure
    keywordsFinite element model
    keywordsReflow soldering
    keywordsSensitivity analysis
    keywordsFatigue failure AND Electronic packages
    treeJournal of Electronic Packaging:;1995:;volume( 117 ):;issue: 002
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
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