contributor author | A. Dasgupta | |
contributor author | V. Ramappan | |
date accessioned | 2017-05-08T23:46:55Z | |
date available | 2017-05-08T23:46:55Z | |
date copyright | June, 1995 | |
date issued | 1995 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26149#141_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/115162 | |
description abstract | Techniques based on physics-of-failure principles are fairly well established for mechanical design of electronic packages. This paper provides an example where such techniques can also be exploited to develop guidelines for assessment of manufacturing quality and its impact on reliability. As a case study, this study examines the influence of plating waviness in vias and Plated Through Holes (PTH), on reliability during solder reflow cycles and during subsequent operational thermal cycling. The stress analysis is performed with elastic-plastic finite element models which are seeded with various levels of plating waviness defects. Sensitivity analysis is done with factorial parametric simulation studies based on Design of Experiment (DOE) methods. Buckling and fatigue failure models are used to establish inspection criteria for acceptable thresholds of plating waviness. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Simulation of the Influence of Manufacturing Quality on Reliability of Vias | |
type | Journal Paper | |
journal volume | 117 | |
journal issue | 2 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.2792081 | |
journal fristpage | 141 | |
journal lastpage | 146 | |
identifier eissn | 1043-7398 | |
keywords | Simulation | |
keywords | Manufacturing | |
keywords | Reliability | |
keywords | Plating | |
keywords | Physics | |
keywords | Inspection | |
keywords | Product quality | |
keywords | Stress analysis (Engineering) | |
keywords | Design | |
keywords | Design engineering | |
keywords | Buckling | |
keywords | Cycles | |
keywords | Failure | |
keywords | Finite element model | |
keywords | Reflow soldering | |
keywords | Sensitivity analysis | |
keywords | Fatigue failure AND Electronic packages | |
tree | Journal of Electronic Packaging:;1995:;volume( 117 ):;issue: 002 | |
contenttype | Fulltext | |