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    Prediction of Electrical Properties of Plain-Weave Fabric Composites for Printed Wiring Board Design

    Source: Journal of Electronic Packaging:;1993:;volume( 115 ):;issue: 002::page 219
    Author:
    R. K. Agarwal
    ,
    A. Dasgupta
    DOI: 10.1115/1.2909321
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A mechanistic model is presented for predicting the effective dielectric constant and loss tangent of woven-fabric reinforced composites with low-loss constituents. A two-scale asymptotic homogenization scheme is used to predict the orthotropic effective properties. A three-dimensional unit-cell enclosing the characteristic periodic repeat pattern in the fabric weave is isolated and modeled mathematically. Electrostatic boundary value problems (BVP’s) are formulated in the unit-cell and are solved analytically to predict effective dielectric constant of the composite, using three-dimensional series-parallel reactance nets. Results are also verified numerically, using finite element methods. The effective dielectric constant and the effective loss tangent are then obtained, analogous to mechanical viscoelastic problems for low-loss materials. The predicted dielectric constant and loss tangent are compared with experimental results for E-glass/epoxy laminates. Frequency dependence of the effective dielectric constant and loss tangent is obtained from the corresponding behavior of the constituent materials. Trade-off studies are conducted to investigate the effect of the constituent material properties on orthotropic effective dielectric permittivity.
    keyword(s): Textiles , Composite materials , Electrical properties , Design , Printed circuit boards , Boundary-value problems , Glass , Laminates , Impedance (Electricity) , Epoxy adhesives , Finite element methods AND Materials properties ,
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      Prediction of Electrical Properties of Plain-Weave Fabric Composites for Printed Wiring Board Design

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    http://yetl.yabesh.ir/yetl1/handle/yetl/111782
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    contributor authorR. K. Agarwal
    contributor authorA. Dasgupta
    date accessioned2017-05-08T23:41:03Z
    date available2017-05-08T23:41:03Z
    date copyrightJune, 1993
    date issued1993
    identifier issn1528-9044
    identifier otherJEPAE4-26137#219_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/111782
    description abstractA mechanistic model is presented for predicting the effective dielectric constant and loss tangent of woven-fabric reinforced composites with low-loss constituents. A two-scale asymptotic homogenization scheme is used to predict the orthotropic effective properties. A three-dimensional unit-cell enclosing the characteristic periodic repeat pattern in the fabric weave is isolated and modeled mathematically. Electrostatic boundary value problems (BVP’s) are formulated in the unit-cell and are solved analytically to predict effective dielectric constant of the composite, using three-dimensional series-parallel reactance nets. Results are also verified numerically, using finite element methods. The effective dielectric constant and the effective loss tangent are then obtained, analogous to mechanical viscoelastic problems for low-loss materials. The predicted dielectric constant and loss tangent are compared with experimental results for E-glass/epoxy laminates. Frequency dependence of the effective dielectric constant and loss tangent is obtained from the corresponding behavior of the constituent materials. Trade-off studies are conducted to investigate the effect of the constituent material properties on orthotropic effective dielectric permittivity.
    publisherThe American Society of Mechanical Engineers (ASME)
    titlePrediction of Electrical Properties of Plain-Weave Fabric Composites for Printed Wiring Board Design
    typeJournal Paper
    journal volume115
    journal issue2
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2909321
    journal fristpage219
    journal lastpage224
    identifier eissn1043-7398
    keywordsTextiles
    keywordsComposite materials
    keywordsElectrical properties
    keywordsDesign
    keywordsPrinted circuit boards
    keywordsBoundary-value problems
    keywordsGlass
    keywordsLaminates
    keywordsImpedance (Electricity)
    keywordsEpoxy adhesives
    keywordsFinite element methods AND Materials properties
    treeJournal of Electronic Packaging:;1993:;volume( 115 ):;issue: 002
    contenttypeFulltext
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