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contributor authorR. K. Agarwal
contributor authorA. Dasgupta
date accessioned2017-05-08T23:41:03Z
date available2017-05-08T23:41:03Z
date copyrightJune, 1993
date issued1993
identifier issn1528-9044
identifier otherJEPAE4-26137#219_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/111782
description abstractA mechanistic model is presented for predicting the effective dielectric constant and loss tangent of woven-fabric reinforced composites with low-loss constituents. A two-scale asymptotic homogenization scheme is used to predict the orthotropic effective properties. A three-dimensional unit-cell enclosing the characteristic periodic repeat pattern in the fabric weave is isolated and modeled mathematically. Electrostatic boundary value problems (BVP’s) are formulated in the unit-cell and are solved analytically to predict effective dielectric constant of the composite, using three-dimensional series-parallel reactance nets. Results are also verified numerically, using finite element methods. The effective dielectric constant and the effective loss tangent are then obtained, analogous to mechanical viscoelastic problems for low-loss materials. The predicted dielectric constant and loss tangent are compared with experimental results for E-glass/epoxy laminates. Frequency dependence of the effective dielectric constant and loss tangent is obtained from the corresponding behavior of the constituent materials. Trade-off studies are conducted to investigate the effect of the constituent material properties on orthotropic effective dielectric permittivity.
publisherThe American Society of Mechanical Engineers (ASME)
titlePrediction of Electrical Properties of Plain-Weave Fabric Composites for Printed Wiring Board Design
typeJournal Paper
journal volume115
journal issue2
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2909321
journal fristpage219
journal lastpage224
identifier eissn1043-7398
keywordsTextiles
keywordsComposite materials
keywordsElectrical properties
keywordsDesign
keywordsPrinted circuit boards
keywordsBoundary-value problems
keywordsGlass
keywordsLaminates
keywordsImpedance (Electricity)
keywordsEpoxy adhesives
keywordsFinite element methods AND Materials properties
treeJournal of Electronic Packaging:;1993:;volume( 115 ):;issue: 002
contenttypeFulltext


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