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    Effective Thermomechanical Behavior of Plain-Weave Fabric-Reinforced Composites Using Homogenization Theory

    Source: Journal of Engineering Materials and Technology:;1994:;volume( 116 ):;issue: 001::page 99
    Author:
    A. Dasgupta
    ,
    S. M. Bhandarkar
    DOI: 10.1115/1.2904262
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A micromechanical analysis is presented to obtain the effective macroscale orthotropic thermomechanical behavior of plain-weave fabric reinforced laminated composites based on a two-scale asymptotic homogenization theory. The model is based on the properties of the constituents and an accurate, three-dimensional simulation of the weave microarchitecture, and is used for predicting the thermomechanical behavior of glass-epoxy (FR-4) woven-fabric laminates typically used by the electronics industry in Multilayered Printed Wiring Boards (MLBs). Parametric studies are conducted to examine the effect of varying fiber volume fractions on constitutive properties. Nonlinear constitutive behavior due to matrix nonlinearity and post-damage behavior due to transverse yarn failure under in-plane uniaxial loads is then investigated. Numerical results obtained from the model show good agreement with experimental values and with data from the literature. This model may be utilized by material designers to design and manufacture fabric reinforced composites with tailored effective properties such as elastic moduli, shear moduli, Poisson’s ratio, and coefficients of thermal expansion.
    keyword(s): Textiles , Composite materials , Glass , Thermal expansion , Fibers , Laminates , Simulation , Yarns , Stress , Epoxy adhesives , Poisson ratio , Shear (Mechanics) , Design , Elastic moduli , Failure , Electronics AND Printed circuit boards ,
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      Effective Thermomechanical Behavior of Plain-Weave Fabric-Reinforced Composites Using Homogenization Theory

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    http://yetl.yabesh.ir/yetl1/handle/yetl/113731
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    • Journal of Engineering Materials and Technology

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    contributor authorA. Dasgupta
    contributor authorS. M. Bhandarkar
    date accessioned2017-05-08T23:44:28Z
    date available2017-05-08T23:44:28Z
    date copyrightJanuary, 1994
    date issued1994
    identifier issn0094-4289
    identifier otherJEMTA8-26961#99_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/113731
    description abstractA micromechanical analysis is presented to obtain the effective macroscale orthotropic thermomechanical behavior of plain-weave fabric reinforced laminated composites based on a two-scale asymptotic homogenization theory. The model is based on the properties of the constituents and an accurate, three-dimensional simulation of the weave microarchitecture, and is used for predicting the thermomechanical behavior of glass-epoxy (FR-4) woven-fabric laminates typically used by the electronics industry in Multilayered Printed Wiring Boards (MLBs). Parametric studies are conducted to examine the effect of varying fiber volume fractions on constitutive properties. Nonlinear constitutive behavior due to matrix nonlinearity and post-damage behavior due to transverse yarn failure under in-plane uniaxial loads is then investigated. Numerical results obtained from the model show good agreement with experimental values and with data from the literature. This model may be utilized by material designers to design and manufacture fabric reinforced composites with tailored effective properties such as elastic moduli, shear moduli, Poisson’s ratio, and coefficients of thermal expansion.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleEffective Thermomechanical Behavior of Plain-Weave Fabric-Reinforced Composites Using Homogenization Theory
    typeJournal Paper
    journal volume116
    journal issue1
    journal titleJournal of Engineering Materials and Technology
    identifier doi10.1115/1.2904262
    journal fristpage99
    journal lastpage105
    identifier eissn1528-8889
    keywordsTextiles
    keywordsComposite materials
    keywordsGlass
    keywordsThermal expansion
    keywordsFibers
    keywordsLaminates
    keywordsSimulation
    keywordsYarns
    keywordsStress
    keywordsEpoxy adhesives
    keywordsPoisson ratio
    keywordsShear (Mechanics)
    keywordsDesign
    keywordsElastic moduli
    keywordsFailure
    keywordsElectronics AND Printed circuit boards
    treeJournal of Engineering Materials and Technology:;1994:;volume( 116 ):;issue: 001
    contenttypeFulltext
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