contributor author | A. Dasgupta | |
contributor author | S. M. Bhandarkar | |
date accessioned | 2017-05-08T23:44:28Z | |
date available | 2017-05-08T23:44:28Z | |
date copyright | January, 1994 | |
date issued | 1994 | |
identifier issn | 0094-4289 | |
identifier other | JEMTA8-26961#99_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/113731 | |
description abstract | A micromechanical analysis is presented to obtain the effective macroscale orthotropic thermomechanical behavior of plain-weave fabric reinforced laminated composites based on a two-scale asymptotic homogenization theory. The model is based on the properties of the constituents and an accurate, three-dimensional simulation of the weave microarchitecture, and is used for predicting the thermomechanical behavior of glass-epoxy (FR-4) woven-fabric laminates typically used by the electronics industry in Multilayered Printed Wiring Boards (MLBs). Parametric studies are conducted to examine the effect of varying fiber volume fractions on constitutive properties. Nonlinear constitutive behavior due to matrix nonlinearity and post-damage behavior due to transverse yarn failure under in-plane uniaxial loads is then investigated. Numerical results obtained from the model show good agreement with experimental values and with data from the literature. This model may be utilized by material designers to design and manufacture fabric reinforced composites with tailored effective properties such as elastic moduli, shear moduli, Poisson’s ratio, and coefficients of thermal expansion. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Effective Thermomechanical Behavior of Plain-Weave Fabric-Reinforced Composites Using Homogenization Theory | |
type | Journal Paper | |
journal volume | 116 | |
journal issue | 1 | |
journal title | Journal of Engineering Materials and Technology | |
identifier doi | 10.1115/1.2904262 | |
journal fristpage | 99 | |
journal lastpage | 105 | |
identifier eissn | 1528-8889 | |
keywords | Textiles | |
keywords | Composite materials | |
keywords | Glass | |
keywords | Thermal expansion | |
keywords | Fibers | |
keywords | Laminates | |
keywords | Simulation | |
keywords | Yarns | |
keywords | Stress | |
keywords | Epoxy adhesives | |
keywords | Poisson ratio | |
keywords | Shear (Mechanics) | |
keywords | Design | |
keywords | Elastic moduli | |
keywords | Failure | |
keywords | Electronics AND Printed circuit boards | |
tree | Journal of Engineering Materials and Technology:;1994:;volume( 116 ):;issue: 001 | |
contenttype | Fulltext | |