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contributor authorA. Dasgupta
contributor authorS. M. Bhandarkar
date accessioned2017-05-08T23:44:28Z
date available2017-05-08T23:44:28Z
date copyrightJanuary, 1994
date issued1994
identifier issn0094-4289
identifier otherJEMTA8-26961#99_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/113731
description abstractA micromechanical analysis is presented to obtain the effective macroscale orthotropic thermomechanical behavior of plain-weave fabric reinforced laminated composites based on a two-scale asymptotic homogenization theory. The model is based on the properties of the constituents and an accurate, three-dimensional simulation of the weave microarchitecture, and is used for predicting the thermomechanical behavior of glass-epoxy (FR-4) woven-fabric laminates typically used by the electronics industry in Multilayered Printed Wiring Boards (MLBs). Parametric studies are conducted to examine the effect of varying fiber volume fractions on constitutive properties. Nonlinear constitutive behavior due to matrix nonlinearity and post-damage behavior due to transverse yarn failure under in-plane uniaxial loads is then investigated. Numerical results obtained from the model show good agreement with experimental values and with data from the literature. This model may be utilized by material designers to design and manufacture fabric reinforced composites with tailored effective properties such as elastic moduli, shear moduli, Poisson’s ratio, and coefficients of thermal expansion.
publisherThe American Society of Mechanical Engineers (ASME)
titleEffective Thermomechanical Behavior of Plain-Weave Fabric-Reinforced Composites Using Homogenization Theory
typeJournal Paper
journal volume116
journal issue1
journal titleJournal of Engineering Materials and Technology
identifier doi10.1115/1.2904262
journal fristpage99
journal lastpage105
identifier eissn1528-8889
keywordsTextiles
keywordsComposite materials
keywordsGlass
keywordsThermal expansion
keywordsFibers
keywordsLaminates
keywordsSimulation
keywordsYarns
keywordsStress
keywordsEpoxy adhesives
keywordsPoisson ratio
keywordsShear (Mechanics)
keywordsDesign
keywordsElastic moduli
keywordsFailure
keywordsElectronics AND Printed circuit boards
treeJournal of Engineering Materials and Technology:;1994:;volume( 116 ):;issue: 001
contenttypeFulltext


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