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Now showing items 21-26 of 26
Combined Vibrational and Thermal Solder Joint Fatigue—A Generalized Strain Versus Life Approach
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The combined effects of elastic and inelastic strains on solder joint reliability are investigated. Experimental data from high-cycle fatigue tests of solder are combined with data from low-cycle ...
Fatigue of Chip Scale Package Interconnects Due to Cyclic Bending
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This study investigates the effect of quasi-static bending loads (strain rate=0.05/s) on the durability of 0.5 mm pitch Chip Scale Package (CSP) interconnects when assembled on FR4 substrates. ...
Influence of Selected Design Variables on Thermo-Mechanical Stress Distributions in Plated-Through-Hole Structures
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Failure of plated-through-holes (PTHs) due to thermomechanical stresses is a well established cause of failure of multilayer printed wiring boards (MLBs). This paper uses the finite element method ...
A Statistical Mechanical Model of Electrical Carbon Fiber Contacts
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper presents a model for electrical carbon fiber contacts. In the model, a statistically distributed fiber length was considered at contact surfaces. A technique of dealing with this ...
Special Issue on Mechanics of Surface Mount Assemblies
Publisher: The American Society of Mechanical Engineers (ASME)
Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 2—With Underfill
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The effect of underfill material on reliability of flip chip on board (FCOB) assemblies is investigated in this study by using two-dimensional and three-dimensional finite element simulations ...