Special Issue on Mechanics of Surface Mount AssembliesSource: Journal of Electronic Packaging:;1995:;volume( 117 ):;issue: 002::page 93Author:D. Barker
,
S. Burchett
,
H. Conrad
,
A. Dasgupta
,
P. Engel
,
J. Lau
,
Y. Pao
,
A. Rafanelli
,
R. Ross
DOI: 10.1115/1.2792086Publisher: The American Society of Mechanical Engineers (ASME)keyword(s): Surface mount assemblies ,
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contributor author | D. Barker | |
contributor author | S. Burchett | |
contributor author | H. Conrad | |
contributor author | A. Dasgupta | |
contributor author | P. Engel | |
contributor author | J. Lau | |
contributor author | Y. Pao | |
contributor author | A. Rafanelli | |
contributor author | R. Ross | |
date accessioned | 2017-05-08T23:46:54Z | |
date available | 2017-05-08T23:46:54Z | |
date copyright | June, 1995 | |
date issued | 1995 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26149#93_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/115152 | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Special Issue on Mechanics of Surface Mount Assemblies | |
type | Journal Paper | |
journal volume | 117 | |
journal issue | 2 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.2792086 | |
journal fristpage | 93 | |
identifier eissn | 1043-7398 | |
keywords | Surface mount assemblies | |
tree | Journal of Electronic Packaging:;1995:;volume( 117 ):;issue: 002 | |
contenttype | Fulltext |