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    Special Issue on Mechanics of Surface Mount Assemblies

    Source: Journal of Electronic Packaging:;1995:;volume( 117 ):;issue: 002::page 93
    Author:
    D. Barker
    ,
    S. Burchett
    ,
    H. Conrad
    ,
    A. Dasgupta
    ,
    P. Engel
    ,
    J. Lau
    ,
    Y. Pao
    ,
    A. Rafanelli
    ,
    R. Ross
    DOI: 10.1115/1.2792086
    Publisher: The American Society of Mechanical Engineers (ASME)
    keyword(s): Surface mount assemblies ,
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      Special Issue on Mechanics of Surface Mount Assemblies

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/115152
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    contributor authorD. Barker
    contributor authorS. Burchett
    contributor authorH. Conrad
    contributor authorA. Dasgupta
    contributor authorP. Engel
    contributor authorJ. Lau
    contributor authorY. Pao
    contributor authorA. Rafanelli
    contributor authorR. Ross
    date accessioned2017-05-08T23:46:54Z
    date available2017-05-08T23:46:54Z
    date copyrightJune, 1995
    date issued1995
    identifier issn1528-9044
    identifier otherJEPAE4-26149#93_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/115152
    publisherThe American Society of Mechanical Engineers (ASME)
    titleSpecial Issue on Mechanics of Surface Mount Assemblies
    typeJournal Paper
    journal volume117
    journal issue2
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2792086
    journal fristpage93
    identifier eissn1043-7398
    keywordsSurface mount assemblies
    treeJournal of Electronic Packaging:;1995:;volume( 117 ):;issue: 002
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian