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Vibration Durability Assessment of Sn3.0Ag0.5Cu and Sn37Pb Solders Under Harmonic Excitation
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this paper, the vibration durability of both SAC305 and Sn37Pb interconnects are investigated with narrow-band harmonic vibration tests conducted at the first natural frequency of the test, ...
Estimating the Vibration Fatigue Life of Quad Leaded Surface Mount Components
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper discusses the assumptions and details of the fatigue life calculations required to predict the fatigue life of quad leaded surface mount components operating in a vibration environment. ...
Solder Creep-Fatigue Analysis by an Energy-Partitioning Approach
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This study explores the possibility of using a unified theory of creep-fatigue, similar to the Halford-Manson strain-range partitioning method, for examining the effect of cyclic temperature range ...
Effect of SMC Lead Dimensional Variabilities on Lead Compliance and Solder Joint Fatigue Life
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Lead compliance is a critical parameter in optimal design and interconnection reliability of surface mount leaded components. The cyclic force transmitted to the solder joint in surface mount ...
Transient Thermal Stress Analysis of a Plated Through Hole Subjected to Wave Soldering
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: During a typical wave soldering operation a plated through hole (PTH) is exposed to temperatures which are higher than any rated operating temperatures. Understanding the heat transfer and the ...
Fatigue Analysis of a Planarpak™ Surface Mount Component
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper discusses the thermo-mechanical fatigue life analysis of an analog Avantek Planarpak™ surface mount device where the entire base of the component is soldered directly to the printed ...
Hygro-Mechanical Durability of Underfilled Flip-Chip-on-Board (FCOB) Interconnects
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The effect of constant temperature and humidity environments on the durability of interconnects in underfilled Flip-Chip-on-Board (FCOB) assemblies is investigated in this study. Polymeric underfills, ...
Shock and Dynamic Loading in Portable Electronic Assemblies: Experimental Results
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The development of portable electronics poses design challenges when evolving new designs for high strain-rate life cycle loading, such as in drop events, blast events, vibration, ultrasonic ...
Shock and Dynamic Loading in Portable Electronic Assemblies: Modeling and Simulation Results
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this study, the transient response of electronic assemblies to mechanical loading encountered in drop and shock conditions are investigated with transient finite element methods. Many manufacturers ...
Thermomechanical Durability of High I/O BGA Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Efficient modeling strategies are developed to study thermomechanical durability of high I/O Ball Grid Array (BGA) packages, in order to facilitate virtual qualification and accelerated testing ...