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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-10 of 12
Finding the Constitutive Relation for a Specific Elastomer
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The main purpose of this study was to determine a suitable strain energy function for a specific elastomer. A survey of various strain energy functions proposed in the past was made. For ...
Thermal Stress and Strain in Microelectronics Packaging
Publisher: The American Society of Mechanical Engineers (ASME)
Structural Analysis of Printed Circuit Board Systems
Publisher: The American Society of Mechanical Engineers (ASME)
Thermal Stress Analysis of Pin Grid Array Structures: Pin and Solder Joint Problems
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The role of the solder joint as an elastic foundation is investigated first for structural analysis of the pin. Failure mechanisms are discussed. For various pin cross sections, guidelines for ...
Structural Analysis in Microelectronics
Publisher: The American Society of Mechanical Engineers (ASME)
Principles of Electronic Packaging
Publisher: The American Society of Mechanical Engineers (ASME)
Tribology and Mechanics of Magnetic Storage Devices
Publisher: The American Society of Mechanical Engineers (ASME)
Special Issue on Mechanics of Surface Mount Assemblies
Publisher: The American Society of Mechanical Engineers (ASME)
Plastic Deformation of Solder Joints in Pin Grid Arrays Subjected to Thermal Stress
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In an earlier work [1], thermal stresses in soldered pins were calculated under the assumption of an elastically deforming solder barrel. In the present analysis, the nonlinear,temperature dependent ...
Solder Joint Reliability—Theory and Applications
Publisher: The American Society of Mechanical Engineers (ASME)