| contributor author | Peter A. Engel | |
| contributor author | Kee Rong Wu | |
| date accessioned | 2017-05-08T23:38:06Z | |
| date available | 2017-05-08T23:38:06Z | |
| date copyright | September, 1992 | |
| date issued | 1992 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26132#314_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/110049 | |
| description abstract | The role of the solder joint as an elastic foundation is investigated first for structural analysis of the pin. Failure mechanisms are discussed. For various pin cross sections, guidelines for computing the foundation constant by analytical and finite element methods are established. Exact expression are derived for the pin stress. The solder stress (radial pressure or tension) is found by an approximate contact analysis. Elasto-plastic pin analysis, for excessive thermal mismatch, is effected by an iterative method. The variation of the plastic domain is examined for various size and material parameters. Axial forces in the presence and absence of pin plasticity are investigated, and the overall effect on the PGA is discussed. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Thermal Stress Analysis of Pin Grid Array Structures: Pin and Solder Joint Problems | |
| type | Journal Paper | |
| journal volume | 114 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2905457 | |
| journal fristpage | 314 | |
| journal lastpage | 321 | |
| identifier eissn | 1043-7398 | |
| keywords | Thermal stresses | |
| keywords | Solder joints | |
| keywords | Stress | |
| keywords | Cross section (Physics) | |
| keywords | Tension | |
| keywords | Finite element methods | |
| keywords | Failure mechanisms | |
| keywords | Iterative methods | |
| keywords | Force | |
| keywords | Pressure | |
| keywords | Plasticity | |
| keywords | Structural analysis AND Solders | |
| tree | Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 003 | |
| contenttype | Fulltext | |