Plastic Deformation of Solder Joints in Pin Grid Arrays Subjected to Thermal StressSource: Journal of Electronic Packaging:;1995:;volume( 117 ):;issue: 002::page 136DOI: 10.1115/1.2792080Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In an earlier work [1], thermal stresses in soldered pins were calculated under the assumption of an elastically deforming solder barrel. In the present analysis, the nonlinear,temperature dependent stress-strain curve of solder, without creep, is taken into account, yielding an elasto-plastic foundation modulus function. For the thermal mismatch loading, the total temperature range ΔT (e.g., 0–100°C) is divided into a finite number n of temperature stages, and the final responses are superposed from the n contributions each of which done using an isothermal stress calculation. Three solders (Sn-Pb solders 63/37, 70/30, and 10/90), were investigated; the solder barrel thickness and mismatch temperature range were also variable parameters. Comparisons with elastic solder foundation calculation results show that thermal and inelastic solder stress/strain dependence should be included especially in the higher (over 75°C) temperature range.
keyword(s): Deformation , Thermal stresses , Solder joints , Solders , Temperature , Stress , Creep , Thickness , Pins (Engineering) AND Stress-strain curves ,
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contributor author | Peter A. Engel | |
contributor author | Shou-Chien Chou | |
date accessioned | 2017-05-08T23:46:55Z | |
date available | 2017-05-08T23:46:55Z | |
date copyright | June, 1995 | |
date issued | 1995 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26149#136_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/115161 | |
description abstract | In an earlier work [1], thermal stresses in soldered pins were calculated under the assumption of an elastically deforming solder barrel. In the present analysis, the nonlinear,temperature dependent stress-strain curve of solder, without creep, is taken into account, yielding an elasto-plastic foundation modulus function. For the thermal mismatch loading, the total temperature range ΔT (e.g., 0–100°C) is divided into a finite number n of temperature stages, and the final responses are superposed from the n contributions each of which done using an isothermal stress calculation. Three solders (Sn-Pb solders 63/37, 70/30, and 10/90), were investigated; the solder barrel thickness and mismatch temperature range were also variable parameters. Comparisons with elastic solder foundation calculation results show that thermal and inelastic solder stress/strain dependence should be included especially in the higher (over 75°C) temperature range. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Plastic Deformation of Solder Joints in Pin Grid Arrays Subjected to Thermal Stress | |
type | Journal Paper | |
journal volume | 117 | |
journal issue | 2 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.2792080 | |
journal fristpage | 136 | |
journal lastpage | 140 | |
identifier eissn | 1043-7398 | |
keywords | Deformation | |
keywords | Thermal stresses | |
keywords | Solder joints | |
keywords | Solders | |
keywords | Temperature | |
keywords | Stress | |
keywords | Creep | |
keywords | Thickness | |
keywords | Pins (Engineering) AND Stress-strain curves | |
tree | Journal of Electronic Packaging:;1995:;volume( 117 ):;issue: 002 | |
contenttype | Fulltext |