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Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In honor of Richard Chu, a symposium on “Thermal Management of Electronic Systems,” was held at the ASME IMECE in Washington DC, in November 2003, where over 45 papers were presented. This ...
Editorial
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: , Tokyo Inst. Technology, Japan, Mohamed-Nabil Sabry, U. Française d' Egypte, Bahgat Sammakia, Binghamton U., USA, and Mamdouh Shoukri, McMaster U., Canada. The chairmen for the conference were Mohamed-Nabil Sabry...
Editorial
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: ; Egypte, Bahgat Sammakia, Binghamton U., USA, and Mamdouh Shoukri, McMaster U., Canada. The chairmen for the conference were Mohamed-Nabil Sabry and Bernard Courtois....
A Transient Technique to Measure the Temperature Coefficient of Resistance for Thin Film Resistors
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The temperature coefficient of resistance (TCR) is defined as: TCR = (R2−R1)R1 × 1(t2−t1) where R2 and R1 are the resistances measured at temperatures t1 and t2 , respectively. The ...
Models of Steady Heat Conduction in Multiple Cylindrical Domains
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An analytical model of steady state heat conduction in multiple cylindrical domains is presented and discussed. The domains are axisymmetric, contiguous, and coaxial. Three domains are considered ...
Heat Conduction in Multilayered Rectangular Domains
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper presents the results of an analytical study of steady state heat conduction in multiple rectangular domains. Any finite number of domains that are equally sized (in plane) may be ...
Thermal Design Criteria for Extraordinary Performance of Devices Cooled by Microchannel Heat Sink
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Increasing power dissipation in microprocessors and other devices is leading to the consideration of more capable thermal solutions than the traditional air-cooled fin heat sinks. Microchannel ...
A Review of Recent Advances in Thermal Management in Three Dimensional Chip Stacks in Electronic Systems
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Three dimensional (3D) integration offers numerous electrical advantages like shorter interconnection distances between different dies in the stack, reduced signal delay, reduced interconnect power ...
Numerical and Experimental Study of the Effect of Underfloor Blockages on Data Center Performance
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Due to the increase in computer rack equipment power in recent years, thermal management of data centers has become a challenging problem. Data center facilities with raised floor plenums are ...
Optimization of Data Center Room Layout to Minimize Rack Inlet Air Temperature
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In a typical raised floor data center with alternating hot and cold aisles, air enters the front of each rack over the entire height of the rack. Since the heat loads of data processing ...