contributor author | Bahgat Sammakia | |
contributor author | Dereje Agonafer | |
date accessioned | 2017-05-09T00:12:47Z | |
date available | 2017-05-09T00:12:47Z | |
date copyright | December, 2004 | |
date issued | 2004 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26239#409_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/129907 | |
description abstract | In honor of Richard Chu, a symposium on “Thermal Management of Electronic Systems,” was held at the ASME IMECE in Washington DC, in November 2003, where over 45 papers were presented. This special issue of the ASME JEP is a compilation of papers selected from that symposium and is a token of appreciation for Richard Chu’s sustained contributions to electronics cooling and thermal management of electronic systems. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Foreword | |
type | Journal Paper | |
journal volume | 126 | |
journal issue | 4 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.1827273 | |
journal fristpage | 409 | |
identifier eissn | 1043-7398 | |
keywords | Heat transfer | |
keywords | Cooling | |
keywords | Cooling systems | |
keywords | Inventions | |
keywords | Engineers | |
keywords | Design | |
keywords | Computers | |
keywords | Thermal management | |
keywords | Water | |
keywords | Computer cooling | |
keywords | Leadership | |
keywords | Patents | |
keywords | Electronic systems | |
keywords | Heat conduction | |
keywords | Complementary metal oxide semiconductors | |
keywords | Electronic packaging | |
keywords | Redundancy (Engineering) | |
keywords | Creativity | |
keywords | Maintenance | |
keywords | Channels (Hydraulic engineering) | |
keywords | Heat sinks | |
keywords | Loudspeakers | |
keywords | Refrigeration | |
keywords | Manufacturing | |
keywords | Presses AND Temperature | |
tree | Journal of Electronic Packaging:;2004:;volume( 126 ):;issue: 004 | |
contenttype | Fulltext | |