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    Foreword

    Source: Journal of Electronic Packaging:;2004:;volume( 126 ):;issue: 004::page 409
    Author:
    Bahgat Sammakia
    ,
    Dereje Agonafer
    DOI: 10.1115/1.1827273
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In honor of Richard Chu, a symposium on “Thermal Management of Electronic Systems,” was held at the ASME IMECE in Washington DC, in November 2003, where over 45 papers were presented. This special issue of the ASME JEP is a compilation of papers selected from that symposium and is a token of appreciation for Richard Chu’s sustained contributions to electronics cooling and thermal management of electronic systems.
    keyword(s): Heat transfer , Cooling , Cooling systems , Inventions , Engineers , Design , Computers , Thermal management , Water , Computer cooling , Leadership , Patents , Electronic systems , Heat conduction , Complementary metal oxide semiconductors , Electronic packaging , Redundancy (Engineering) , Creativity , Maintenance , Channels (Hydraulic engineering) , Heat sinks , Loudspeakers , Refrigeration , Manufacturing , Presses AND Temperature ,
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      Foreword

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/129907
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    contributor authorBahgat Sammakia
    contributor authorDereje Agonafer
    date accessioned2017-05-09T00:12:47Z
    date available2017-05-09T00:12:47Z
    date copyrightDecember, 2004
    date issued2004
    identifier issn1528-9044
    identifier otherJEPAE4-26239#409_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/129907
    description abstractIn honor of Richard Chu, a symposium on “Thermal Management of Electronic Systems,” was held at the ASME IMECE in Washington DC, in November 2003, where over 45 papers were presented. This special issue of the ASME JEP is a compilation of papers selected from that symposium and is a token of appreciation for Richard Chu’s sustained contributions to electronics cooling and thermal management of electronic systems.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleForeword
    typeJournal Paper
    journal volume126
    journal issue4
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.1827273
    journal fristpage409
    identifier eissn1043-7398
    keywordsHeat transfer
    keywordsCooling
    keywordsCooling systems
    keywordsInventions
    keywordsEngineers
    keywordsDesign
    keywordsComputers
    keywordsThermal management
    keywordsWater
    keywordsComputer cooling
    keywordsLeadership
    keywordsPatents
    keywordsElectronic systems
    keywordsHeat conduction
    keywordsComplementary metal oxide semiconductors
    keywordsElectronic packaging
    keywordsRedundancy (Engineering)
    keywordsCreativity
    keywordsMaintenance
    keywordsChannels (Hydraulic engineering)
    keywordsHeat sinks
    keywordsLoudspeakers
    keywordsRefrigeration
    keywordsManufacturing
    keywordsPresses AND Temperature
    treeJournal of Electronic Packaging:;2004:;volume( 126 ):;issue: 004
    contenttypeFulltext
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