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contributor authorBahgat Sammakia
contributor authorDereje Agonafer
date accessioned2017-05-09T00:12:47Z
date available2017-05-09T00:12:47Z
date copyrightDecember, 2004
date issued2004
identifier issn1528-9044
identifier otherJEPAE4-26239#409_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/129907
description abstractIn honor of Richard Chu, a symposium on “Thermal Management of Electronic Systems,” was held at the ASME IMECE in Washington DC, in November 2003, where over 45 papers were presented. This special issue of the ASME JEP is a compilation of papers selected from that symposium and is a token of appreciation for Richard Chu’s sustained contributions to electronics cooling and thermal management of electronic systems.
publisherThe American Society of Mechanical Engineers (ASME)
titleForeword
typeJournal Paper
journal volume126
journal issue4
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.1827273
journal fristpage409
identifier eissn1043-7398
keywordsHeat transfer
keywordsCooling
keywordsCooling systems
keywordsInventions
keywordsEngineers
keywordsDesign
keywordsComputers
keywordsThermal management
keywordsWater
keywordsComputer cooling
keywordsLeadership
keywordsPatents
keywordsElectronic systems
keywordsHeat conduction
keywordsComplementary metal oxide semiconductors
keywordsElectronic packaging
keywordsRedundancy (Engineering)
keywordsCreativity
keywordsMaintenance
keywordsChannels (Hydraulic engineering)
keywordsHeat sinks
keywordsLoudspeakers
keywordsRefrigeration
keywordsManufacturing
keywordsPresses AND Temperature
treeJournal of Electronic Packaging:;2004:;volume( 126 ):;issue: 004
contenttypeFulltext


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