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    A Transient Technique to Measure the Temperature Coefficient of Resistance for Thin Film Resistors

    Source: Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 002::page 143
    Author:
    Bahgat Sammakia
    ,
    Phillip Vadala
    ,
    Thomas Homa
    DOI: 10.1115/1.3226520
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The temperature coefficient of resistance (TCR) is defined as: TCR = (R2−R1)R1 × 1(t2−t1) where R2 and R1 are the resistances measured at temperatures t1 and t2 , respectively. The conventional TCR measurement method consists of measuring resistance at room temperature, then heating the resistor to a known higher temperature, then measuring the resistance again. This technique is very accurate and repeatable, however it is slow and cumbersome because it takes a moderate amount of time for the sample to reach steady state in an oven before the resistance can be measured. The present study proposes a new transient technique for measuring TCR. Thin film resistors are heated by passing a constant electric current through them. At an arbitrarily set time, the resistor temperature is estimated from the known transient conduction solution for a uniform flux surface imbedded in a semi-infinite medium. Measurements of the resistance at that time, along with the resistance at the initial (usually room) temperature will now permit the calculation of TCR. The method was found to be very fast, repeatable, and in good agreement with the conventional technique.
    keyword(s): Thin films , Temperature , Electrical resistance , Resistors , Steady state , Heating , Ovens , Electric current , Measurement AND Heat conduction ,
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      A Transient Technique to Measure the Temperature Coefficient of Resistance for Thin Film Resistors

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/105262
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    • Journal of Electronic Packaging

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    contributor authorBahgat Sammakia
    contributor authorPhillip Vadala
    contributor authorThomas Homa
    date accessioned2017-05-08T23:29:45Z
    date available2017-05-08T23:29:45Z
    date copyrightJune, 1989
    date issued1989
    identifier issn1528-9044
    identifier otherJEPAE4-26108#143_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/105262
    description abstractThe temperature coefficient of resistance (TCR) is defined as: TCR = (R2−R1)R1 × 1(t2−t1) where R2 and R1 are the resistances measured at temperatures t1 and t2 , respectively. The conventional TCR measurement method consists of measuring resistance at room temperature, then heating the resistor to a known higher temperature, then measuring the resistance again. This technique is very accurate and repeatable, however it is slow and cumbersome because it takes a moderate amount of time for the sample to reach steady state in an oven before the resistance can be measured. The present study proposes a new transient technique for measuring TCR. Thin film resistors are heated by passing a constant electric current through them. At an arbitrarily set time, the resistor temperature is estimated from the known transient conduction solution for a uniform flux surface imbedded in a semi-infinite medium. Measurements of the resistance at that time, along with the resistance at the initial (usually room) temperature will now permit the calculation of TCR. The method was found to be very fast, repeatable, and in good agreement with the conventional technique.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleA Transient Technique to Measure the Temperature Coefficient of Resistance for Thin Film Resistors
    typeJournal Paper
    journal volume111
    journal issue2
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.3226520
    journal fristpage143
    journal lastpage148
    identifier eissn1043-7398
    keywordsThin films
    keywordsTemperature
    keywordsElectrical resistance
    keywordsResistors
    keywordsSteady state
    keywordsHeating
    keywordsOvens
    keywordsElectric current
    keywordsMeasurement AND Heat conduction
    treeJournal of Electronic Packaging:;1989:;volume( 111 ):;issue: 002
    contenttypeFulltext
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