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contributor authorBahgat Sammakia
contributor authorPhillip Vadala
contributor authorThomas Homa
date accessioned2017-05-08T23:29:45Z
date available2017-05-08T23:29:45Z
date copyrightJune, 1989
date issued1989
identifier issn1528-9044
identifier otherJEPAE4-26108#143_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/105262
description abstractThe temperature coefficient of resistance (TCR) is defined as: TCR = (R2−R1)R1 × 1(t2−t1) where R2 and R1 are the resistances measured at temperatures t1 and t2 , respectively. The conventional TCR measurement method consists of measuring resistance at room temperature, then heating the resistor to a known higher temperature, then measuring the resistance again. This technique is very accurate and repeatable, however it is slow and cumbersome because it takes a moderate amount of time for the sample to reach steady state in an oven before the resistance can be measured. The present study proposes a new transient technique for measuring TCR. Thin film resistors are heated by passing a constant electric current through them. At an arbitrarily set time, the resistor temperature is estimated from the known transient conduction solution for a uniform flux surface imbedded in a semi-infinite medium. Measurements of the resistance at that time, along with the resistance at the initial (usually room) temperature will now permit the calculation of TCR. The method was found to be very fast, repeatable, and in good agreement with the conventional technique.
publisherThe American Society of Mechanical Engineers (ASME)
titleA Transient Technique to Measure the Temperature Coefficient of Resistance for Thin Film Resistors
typeJournal Paper
journal volume111
journal issue2
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.3226520
journal fristpage143
journal lastpage148
identifier eissn1043-7398
keywordsThin films
keywordsTemperature
keywordsElectrical resistance
keywordsResistors
keywordsSteady state
keywordsHeating
keywordsOvens
keywordsElectric current
keywordsMeasurement AND Heat conduction
treeJournal of Electronic Packaging:;1989:;volume( 111 ):;issue: 002
contenttypeFulltext


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