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    Editorial

    Source: Journal of Electronic Packaging:;2008:;volume( 130 ):;issue: 004::page 40201
    Author:
    Bahgat Sammakia
    ,
    Mohamed-Nabil Sabry
    DOI: 10.1115/1.3039759
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This issue of the Journal of Electronic Packaging has eight papers selected from the first international conference on thermal issues in emerging technologies theory and applications (ThETA I) held in Cairo, Egypt, January 3–6, 2007. The objectives of the conference are to encourage dissemination of information and research in areas related to transport and emerging technologies in various domains, including microelectronics, nanotechnology, smart materials, micro-electro-mechanical systems, and biomedical engineering. The importance of transport in these areas is becoming a dominant factor in determining the performance of such technologies. The ThETA I conference was very successful and attracted many prominent researchers from the US, Europe, and the Far East to participate and interact with researchers from the Middle East, in general, and Egypt in particular. The eight papers presented in this special issue represent some of the best ideas presented at the conference, and deemed worthy of archival publication in the JEP after the papers were reviewed again by the JEP with Professor Mohamed-Nabil Sabry serving as the special guest editor for the issue. The ThETA I executive committee consisted of Bernard Courtois, TIMA Lab., Grenoble, France, Yogendra Joshi, Georgia Inst. Technology, USA, Waturu Nakayama, Tokyo Inst. Technology, Japan, Mohamed-Nabil Sabry, U. Française d' Egypte, Bahgat Sammakia, Binghamton U., USA, and Mamdouh Shoukri, McMaster U., Canada. The chairmen for the conference were Mohamed-Nabil Sabry and Bernard Courtois.
    keyword(s): Physics , Temperature , Heat transfer , Cooling , Workshops (Work spaces) , Reliability , Electronic packaging , Simulation , Smart materials , Biomedical engineering , Engineering teachers , Microelectromechanical systems , Experimental methods , Fuel cells , Mechatronics , Modeling , Nanotechnology , Optimization , Refrigeration , Two-phase flow , Computers , Data centers , Electronic systems , Japan Society of Mechanical Engineers , Thermal management , Microelectronic devices , Electronics AND Micro gas turbines ,
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      Editorial

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    http://yetl.yabesh.ir/yetl1/handle/yetl/137792
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    contributor authorBahgat Sammakia
    contributor authorMohamed-Nabil Sabry
    date accessioned2017-05-09T00:27:39Z
    date available2017-05-09T00:27:39Z
    date copyrightDecember, 2008
    date issued2008
    identifier issn1528-9044
    identifier otherJEPAE4-26289#040201_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/137792
    description abstractThis issue of the Journal of Electronic Packaging has eight papers selected from the first international conference on thermal issues in emerging technologies theory and applications (ThETA I) held in Cairo, Egypt, January 3–6, 2007. The objectives of the conference are to encourage dissemination of information and research in areas related to transport and emerging technologies in various domains, including microelectronics, nanotechnology, smart materials, micro-electro-mechanical systems, and biomedical engineering. The importance of transport in these areas is becoming a dominant factor in determining the performance of such technologies. The ThETA I conference was very successful and attracted many prominent researchers from the US, Europe, and the Far East to participate and interact with researchers from the Middle East, in general, and Egypt in particular. The eight papers presented in this special issue represent some of the best ideas presented at the conference, and deemed worthy of archival publication in the JEP after the papers were reviewed again by the JEP with Professor Mohamed-Nabil Sabry serving as the special guest editor for the issue. The ThETA I executive committee consisted of Bernard Courtois, TIMA Lab., Grenoble, France, Yogendra Joshi, Georgia Inst. Technology, USA, Waturu Nakayama, Tokyo Inst. Technology, Japan, Mohamed-Nabil Sabry, U. Française d' Egypte, Bahgat Sammakia, Binghamton U., USA, and Mamdouh Shoukri, McMaster U., Canada. The chairmen for the conference were Mohamed-Nabil Sabry and Bernard Courtois.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleEditorial
    typeJournal Paper
    journal volume130
    journal issue4
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.3039759
    journal fristpage40201
    identifier eissn1043-7398
    keywordsPhysics
    keywordsTemperature
    keywordsHeat transfer
    keywordsCooling
    keywordsWorkshops (Work spaces)
    keywordsReliability
    keywordsElectronic packaging
    keywordsSimulation
    keywordsSmart materials
    keywordsBiomedical engineering
    keywordsEngineering teachers
    keywordsMicroelectromechanical systems
    keywordsExperimental methods
    keywordsFuel cells
    keywordsMechatronics
    keywordsModeling
    keywordsNanotechnology
    keywordsOptimization
    keywordsRefrigeration
    keywordsTwo-phase flow
    keywordsComputers
    keywordsData centers
    keywordsElectronic systems
    keywordsJapan Society of Mechanical Engineers
    keywordsThermal management
    keywordsMicroelectronic devices
    keywordsElectronics AND Micro gas turbines
    treeJournal of Electronic Packaging:;2008:;volume( 130 ):;issue: 004
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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