Show simple item record

contributor authorBahgat Sammakia
contributor authorMohamed-Nabil Sabry
date accessioned2017-05-09T00:27:39Z
date available2017-05-09T00:27:39Z
date copyrightDecember, 2008
date issued2008
identifier issn1528-9044
identifier otherJEPAE4-26289#040201_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/137792
description abstractThis issue of the Journal of Electronic Packaging has eight papers selected from the first international conference on thermal issues in emerging technologies theory and applications (ThETA I) held in Cairo, Egypt, January 3–6, 2007. The objectives of the conference are to encourage dissemination of information and research in areas related to transport and emerging technologies in various domains, including microelectronics, nanotechnology, smart materials, micro-electro-mechanical systems, and biomedical engineering. The importance of transport in these areas is becoming a dominant factor in determining the performance of such technologies. The ThETA I conference was very successful and attracted many prominent researchers from the US, Europe, and the Far East to participate and interact with researchers from the Middle East, in general, and Egypt in particular. The eight papers presented in this special issue represent some of the best ideas presented at the conference, and deemed worthy of archival publication in the JEP after the papers were reviewed again by the JEP with Professor Mohamed-Nabil Sabry serving as the special guest editor for the issue. The ThETA I executive committee consisted of Bernard Courtois, TIMA Lab., Grenoble, France, Yogendra Joshi, Georgia Inst. Technology, USA, Waturu Nakayama, Tokyo Inst. Technology, Japan, Mohamed-Nabil Sabry, U. Française d' Egypte, Bahgat Sammakia, Binghamton U., USA, and Mamdouh Shoukri, McMaster U., Canada. The chairmen for the conference were Mohamed-Nabil Sabry and Bernard Courtois.
publisherThe American Society of Mechanical Engineers (ASME)
titleEditorial
typeJournal Paper
journal volume130
journal issue4
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.3039759
journal fristpage40201
identifier eissn1043-7398
keywordsPhysics
keywordsTemperature
keywordsHeat transfer
keywordsCooling
keywordsWorkshops (Work spaces)
keywordsReliability
keywordsElectronic packaging
keywordsSimulation
keywordsSmart materials
keywordsBiomedical engineering
keywordsEngineering teachers
keywordsMicroelectromechanical systems
keywordsExperimental methods
keywordsFuel cells
keywordsMechatronics
keywordsModeling
keywordsNanotechnology
keywordsOptimization
keywordsRefrigeration
keywordsTwo-phase flow
keywordsComputers
keywordsData centers
keywordsElectronic systems
keywordsJapan Society of Mechanical Engineers
keywordsThermal management
keywordsMicroelectronic devices
keywordsElectronics AND Micro gas turbines
treeJournal of Electronic Packaging:;2008:;volume( 130 ):;issue: 004
contenttypeFulltext


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record