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    Thermal Design Criteria for Extraordinary Performance of Devices Cooled by Microchannel Heat Sink

    Source: Journal of Thermal Science and Engineering Applications:;2010:;volume( 002 ):;issue: 004::page 41001
    Author:
    Dylan Farnam
    ,
    Kanad Ghose
    ,
    Bahgat Sammakia
    DOI: 10.1115/1.4002841
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Increasing power dissipation in microprocessors and other devices is leading to the consideration of more capable thermal solutions than the traditional air-cooled fin heat sinks. Microchannel heat sinks (MHSs) are promising candidates for long-term thermal solution given their simplicity, performance, and the development of MHS-compatible 3D device architecture. As the traditional methods of cooling generally have uniform heat removal on the contact area with the device, thermal consequences of design have traditionally been considered only after the layout of components on a device is finalized in accordance with connection and other criteria. Unlike traditional cooling solutions, however, microchannel heat sinks provide highly nonuniform heat removal on the contact area with the device. This feature is of utmost importance and can actually be used quite advantageously, if considered during the design phase of a device. In this study, simple thermal design criteria governing the general placement of components on devices to be cooled by microchannel heat sink are developed and presented. These thermal criteria are not meant to supersede connection and other important design criteria but are intended as a necessary and valuable supplement. Full-scale numerical simulations of a device with a realistic power map cooled by microchannel heat sink prove the effectiveness of the criteria, showing large reduction in maximum operating temperature and harmful temperature gradients. The simulations further show that the device and microchannel heat sink can dissipate a comparatively high amount of power, with little thermal danger, when design considers the criteria developed herein.
    keyword(s): Design , Heat sinks , Microchannels , Temperature gradients , Channels (Hydraulic engineering) , Heat , Temperature AND Energy dissipation ,
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      Thermal Design Criteria for Extraordinary Performance of Devices Cooled by Microchannel Heat Sink

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/144809
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    • Journal of Thermal Science and Engineering Applications

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    contributor authorDylan Farnam
    contributor authorKanad Ghose
    contributor authorBahgat Sammakia
    date accessioned2017-05-09T00:40:50Z
    date available2017-05-09T00:40:50Z
    date copyrightDecember, 2010
    date issued2010
    identifier issn1948-5085
    identifier otherJTSEBV-28825#041001_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/144809
    description abstractIncreasing power dissipation in microprocessors and other devices is leading to the consideration of more capable thermal solutions than the traditional air-cooled fin heat sinks. Microchannel heat sinks (MHSs) are promising candidates for long-term thermal solution given their simplicity, performance, and the development of MHS-compatible 3D device architecture. As the traditional methods of cooling generally have uniform heat removal on the contact area with the device, thermal consequences of design have traditionally been considered only after the layout of components on a device is finalized in accordance with connection and other criteria. Unlike traditional cooling solutions, however, microchannel heat sinks provide highly nonuniform heat removal on the contact area with the device. This feature is of utmost importance and can actually be used quite advantageously, if considered during the design phase of a device. In this study, simple thermal design criteria governing the general placement of components on devices to be cooled by microchannel heat sink are developed and presented. These thermal criteria are not meant to supersede connection and other important design criteria but are intended as a necessary and valuable supplement. Full-scale numerical simulations of a device with a realistic power map cooled by microchannel heat sink prove the effectiveness of the criteria, showing large reduction in maximum operating temperature and harmful temperature gradients. The simulations further show that the device and microchannel heat sink can dissipate a comparatively high amount of power, with little thermal danger, when design considers the criteria developed herein.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleThermal Design Criteria for Extraordinary Performance of Devices Cooled by Microchannel Heat Sink
    typeJournal Paper
    journal volume2
    journal issue4
    journal titleJournal of Thermal Science and Engineering Applications
    identifier doi10.1115/1.4002841
    journal fristpage41001
    identifier eissn1948-5093
    keywordsDesign
    keywordsHeat sinks
    keywordsMicrochannels
    keywordsTemperature gradients
    keywordsChannels (Hydraulic engineering)
    keywordsHeat
    keywordsTemperature AND Energy dissipation
    treeJournal of Thermal Science and Engineering Applications:;2010:;volume( 002 ):;issue: 004
    contenttypeFulltext
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