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    Optimization of Data Center Room Layout to Minimize Rack Inlet Air Temperature

    Source: Journal of Electronic Packaging:;2006:;volume( 128 ):;issue: 004::page 380
    Author:
    Siddharth Bhopte
    ,
    Dereje Agonafer
    ,
    Roger Schmidt
    ,
    Bahgat Sammakia
    DOI: 10.1115/1.2356866
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In a typical raised floor data center with alternating hot and cold aisles, air enters the front of each rack over the entire height of the rack. Since the heat loads of data processing equipment continue to increase at a rapid rate, it is a challenge to maintain the temperature of all the racks within the stated requirement. A facility manager has discretion in deciding the data center room layout, but a wrong decision will eventually lead to equipment failure. There are many complex decisions to be made early in the design as the data center evolves. Challenges occur such as optimizing the raised floor plenum, floor tile placement, minimizing the data center local hot spots, etc. These adjustments in configuration affect rack inlet air temperatures, which is one of the important keys to effective thermal management. In this paper, a raised floor data center with 12kW racks is considered. There are four rows of racks with alternating hot and cold aisle arrangement. Each row has six racks installed. Two air-conditioning units supply chilled air to the data center through the pressurized plenum. Effect of plenum depth, floor tile placement, and ceiling height on the rack inlet air temperature is discussed. Plots will be presented over the defined range. A multivariable approach to optimize data center room layout to minimize the rack inlet air temperature is proposed. Significant improvement over the initial model is shown by using a multivariable design optimization approach.
    keyword(s): Temperature , Ceilings , Optimization , Data centers AND Design ,
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      Optimization of Data Center Room Layout to Minimize Rack Inlet Air Temperature

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    http://yetl.yabesh.ir/yetl1/handle/yetl/133502
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    • Journal of Electronic Packaging

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    contributor authorSiddharth Bhopte
    contributor authorDereje Agonafer
    contributor authorRoger Schmidt
    contributor authorBahgat Sammakia
    date accessioned2017-05-09T00:19:32Z
    date available2017-05-09T00:19:32Z
    date copyrightDecember, 2006
    date issued2006
    identifier issn1528-9044
    identifier otherJEPAE4-26266#380_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/133502
    description abstractIn a typical raised floor data center with alternating hot and cold aisles, air enters the front of each rack over the entire height of the rack. Since the heat loads of data processing equipment continue to increase at a rapid rate, it is a challenge to maintain the temperature of all the racks within the stated requirement. A facility manager has discretion in deciding the data center room layout, but a wrong decision will eventually lead to equipment failure. There are many complex decisions to be made early in the design as the data center evolves. Challenges occur such as optimizing the raised floor plenum, floor tile placement, minimizing the data center local hot spots, etc. These adjustments in configuration affect rack inlet air temperatures, which is one of the important keys to effective thermal management. In this paper, a raised floor data center with 12kW racks is considered. There are four rows of racks with alternating hot and cold aisle arrangement. Each row has six racks installed. Two air-conditioning units supply chilled air to the data center through the pressurized plenum. Effect of plenum depth, floor tile placement, and ceiling height on the rack inlet air temperature is discussed. Plots will be presented over the defined range. A multivariable approach to optimize data center room layout to minimize the rack inlet air temperature is proposed. Significant improvement over the initial model is shown by using a multivariable design optimization approach.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleOptimization of Data Center Room Layout to Minimize Rack Inlet Air Temperature
    typeJournal Paper
    journal volume128
    journal issue4
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2356866
    journal fristpage380
    journal lastpage387
    identifier eissn1043-7398
    keywordsTemperature
    keywordsCeilings
    keywordsOptimization
    keywordsData centers AND Design
    treeJournal of Electronic Packaging:;2006:;volume( 128 ):;issue: 004
    contenttypeFulltext
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    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian