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contributor authorSiddharth Bhopte
contributor authorDereje Agonafer
contributor authorRoger Schmidt
contributor authorBahgat Sammakia
date accessioned2017-05-09T00:19:32Z
date available2017-05-09T00:19:32Z
date copyrightDecember, 2006
date issued2006
identifier issn1528-9044
identifier otherJEPAE4-26266#380_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/133502
description abstractIn a typical raised floor data center with alternating hot and cold aisles, air enters the front of each rack over the entire height of the rack. Since the heat loads of data processing equipment continue to increase at a rapid rate, it is a challenge to maintain the temperature of all the racks within the stated requirement. A facility manager has discretion in deciding the data center room layout, but a wrong decision will eventually lead to equipment failure. There are many complex decisions to be made early in the design as the data center evolves. Challenges occur such as optimizing the raised floor plenum, floor tile placement, minimizing the data center local hot spots, etc. These adjustments in configuration affect rack inlet air temperatures, which is one of the important keys to effective thermal management. In this paper, a raised floor data center with 12kW racks is considered. There are four rows of racks with alternating hot and cold aisle arrangement. Each row has six racks installed. Two air-conditioning units supply chilled air to the data center through the pressurized plenum. Effect of plenum depth, floor tile placement, and ceiling height on the rack inlet air temperature is discussed. Plots will be presented over the defined range. A multivariable approach to optimize data center room layout to minimize the rack inlet air temperature is proposed. Significant improvement over the initial model is shown by using a multivariable design optimization approach.
publisherThe American Society of Mechanical Engineers (ASME)
titleOptimization of Data Center Room Layout to Minimize Rack Inlet Air Temperature
typeJournal Paper
journal volume128
journal issue4
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2356866
journal fristpage380
journal lastpage387
identifier eissn1043-7398
keywordsTemperature
keywordsCeilings
keywordsOptimization
keywordsData centers AND Design
treeJournal of Electronic Packaging:;2006:;volume( 128 ):;issue: 004
contenttypeFulltext


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