EditorialSource: Journal of Electronic Packaging:;2010:;volume( 132 ):;issue: 003::page 30201DOI: 10.1115/1.3493694Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This issue of the Journal of Electronic Packaging has six papers selected from the second international conference on thermal issues in emerging technologies theory and applications. This conference (ThETA2) was held in Cairo, Egypt, December 17–20, 2008. The objectives of the conference are to encourage dissemination of information and research in areas related to transport and emerging technologies in various domains. The main conference objective is to address the growing impact of thermal issues on many advanced and emerging technologies including Microelectronics, Nanotechnology, Smart Materials, Micro-Electro-Mechanical Systems, Biomedical Engineering, and Green Energy. The importance of transport in these areas is becoming a dominant factor in determining the performance of such technologies. The ThETA2 conference was very successful and attracted many prominent researchers from the US, Europe, and the Far East to participate and interact with researchers from the Middle East, in general, and Egypt in particular. The seven papers presented in this special issue represent some of the best ideas presented at the conference, and deemed worthy of archival publication in the JEP after the papers were reviewed again by the JEP with Professor Mohamed-Nabil Sabry serving as the special guest editor for the issue. The ThETA2 executive committee consisted of Bernard Courtois, TIMA Lab., Grenoble, France, Yogendra Joshi, Georgia Inst. Technology, USA, Waturu Nakayama, Tokyo Inst. Technology, Japan, Mohamed-Nabil Sabry, U. Française d' Egypte, Bahgat Sammakia, Binghamton U., USA, and Mamdouh Shoukri, McMaster U., Canada. The chairmen for the conference were Mohamed-Nabil Sabry and Bernard Courtois.
keyword(s): Physics , Temperature , Heat transfer , Cooling , Fluids , Workshops (Work spaces) , Reliability , Electronic packaging , Simulation , Smart materials , Biomedical engineering , Engineering teachers , Microelectromechanical systems , Experimental methods , Fuel cells , Heat pipes , Mechatronics , Modeling , Nanotechnology , Optimization , Two-phase flow , Computers , Data centers , Electronic systems , Japan Society of Mechanical Engineers , Microelectronic devices AND Micro gas turbines , |
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contributor author | Bahgat Sammakia | |
contributor author | Mohamed-Nabil Sabry | |
date accessioned | 2017-05-09T00:37:16Z | |
date available | 2017-05-09T00:37:16Z | |
date copyright | September, 2010 | |
date issued | 2010 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26306#030201_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/142977 | |
description abstract | This issue of the Journal of Electronic Packaging has six papers selected from the second international conference on thermal issues in emerging technologies theory and applications. This conference (ThETA2) was held in Cairo, Egypt, December 17–20, 2008. The objectives of the conference are to encourage dissemination of information and research in areas related to transport and emerging technologies in various domains. The main conference objective is to address the growing impact of thermal issues on many advanced and emerging technologies including Microelectronics, Nanotechnology, Smart Materials, Micro-Electro-Mechanical Systems, Biomedical Engineering, and Green Energy. The importance of transport in these areas is becoming a dominant factor in determining the performance of such technologies. The ThETA2 conference was very successful and attracted many prominent researchers from the US, Europe, and the Far East to participate and interact with researchers from the Middle East, in general, and Egypt in particular. The seven papers presented in this special issue represent some of the best ideas presented at the conference, and deemed worthy of archival publication in the JEP after the papers were reviewed again by the JEP with Professor Mohamed-Nabil Sabry serving as the special guest editor for the issue. The ThETA2 executive committee consisted of Bernard Courtois, TIMA Lab., Grenoble, France, Yogendra Joshi, Georgia Inst. Technology, USA, Waturu Nakayama, Tokyo Inst. Technology, Japan, Mohamed-Nabil Sabry, U. Française d' Egypte, Bahgat Sammakia, Binghamton U., USA, and Mamdouh Shoukri, McMaster U., Canada. The chairmen for the conference were Mohamed-Nabil Sabry and Bernard Courtois. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Editorial | |
type | Journal Paper | |
journal volume | 132 | |
journal issue | 3 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.3493694 | |
journal fristpage | 30201 | |
identifier eissn | 1043-7398 | |
keywords | Physics | |
keywords | Temperature | |
keywords | Heat transfer | |
keywords | Cooling | |
keywords | Fluids | |
keywords | Workshops (Work spaces) | |
keywords | Reliability | |
keywords | Electronic packaging | |
keywords | Simulation | |
keywords | Smart materials | |
keywords | Biomedical engineering | |
keywords | Engineering teachers | |
keywords | Microelectromechanical systems | |
keywords | Experimental methods | |
keywords | Fuel cells | |
keywords | Heat pipes | |
keywords | Mechatronics | |
keywords | Modeling | |
keywords | Nanotechnology | |
keywords | Optimization | |
keywords | Two-phase flow | |
keywords | Computers | |
keywords | Data centers | |
keywords | Electronic systems | |
keywords | Japan Society of Mechanical Engineers | |
keywords | Microelectronic devices AND Micro gas turbines | |
tree | Journal of Electronic Packaging:;2010:;volume( 132 ):;issue: 003 | |
contenttype | Fulltext |