YaBeSH Engineering and Technology Library

    • Journals
    • PaperQuest
    • YSE Standards
    • YaBeSH
    • Login
    View Item 
    •   YE&T Library
    • ASME
    • Journal of Electronic Packaging
    • View Item
    •   YE&T Library
    • ASME
    • Journal of Electronic Packaging
    • View Item
    • All Fields
    • Source Title
    • Year
    • Publisher
    • Title
    • Subject
    • Author
    • DOI
    • ISBN
    Advanced Search
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Archive

    Editorial

    Source: Journal of Electronic Packaging:;2010:;volume( 132 ):;issue: 003::page 30201
    Author:
    Bahgat Sammakia
    ,
    Mohamed-Nabil Sabry
    DOI: 10.1115/1.3493694
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This issue of the Journal of Electronic Packaging has six papers selected from the second international conference on thermal issues in emerging technologies theory and applications. This conference (ThETA2) was held in Cairo, Egypt, December 17–20, 2008. The objectives of the conference are to encourage dissemination of information and research in areas related to transport and emerging technologies in various domains. The main conference objective is to address the growing impact of thermal issues on many advanced and emerging technologies including Microelectronics, Nanotechnology, Smart Materials, Micro-Electro-Mechanical Systems, Biomedical Engineering, and Green Energy. The importance of transport in these areas is becoming a dominant factor in determining the performance of such technologies. The ThETA2 conference was very successful and attracted many prominent researchers from the US, Europe, and the Far East to participate and interact with researchers from the Middle East, in general, and Egypt in particular. The seven papers presented in this special issue represent some of the best ideas presented at the conference, and deemed worthy of archival publication in the JEP after the papers were reviewed again by the JEP with Professor Mohamed-Nabil Sabry serving as the special guest editor for the issue. The ThETA2 executive committee consisted of Bernard Courtois, TIMA Lab., Grenoble, France, Yogendra Joshi, Georgia Inst. Technology, USA, Waturu Nakayama, Tokyo Inst. Technology, Japan, Mohamed-Nabil Sabry, U. Française d' Egypte, Bahgat Sammakia, Binghamton U., USA, and Mamdouh Shoukri, McMaster U., Canada. The chairmen for the conference were Mohamed-Nabil Sabry and Bernard Courtois.
    keyword(s): Physics , Temperature , Heat transfer , Cooling , Fluids , Workshops (Work spaces) , Reliability , Electronic packaging , Simulation , Smart materials , Biomedical engineering , Engineering teachers , Microelectromechanical systems , Experimental methods , Fuel cells , Heat pipes , Mechatronics , Modeling , Nanotechnology , Optimization , Two-phase flow , Computers , Data centers , Electronic systems , Japan Society of Mechanical Engineers , Microelectronic devices AND Micro gas turbines ,
    • Download: (33.78Kb)
    • Show Full MetaData Hide Full MetaData
    • Get RIS
    • Item Order
    • Go To Publisher
    • Price: 5000 Rial
    • Statistics

      Editorial

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/142977
    Collections
    • Journal of Electronic Packaging

    Show full item record

    contributor authorBahgat Sammakia
    contributor authorMohamed-Nabil Sabry
    date accessioned2017-05-09T00:37:16Z
    date available2017-05-09T00:37:16Z
    date copyrightSeptember, 2010
    date issued2010
    identifier issn1528-9044
    identifier otherJEPAE4-26306#030201_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/142977
    description abstractThis issue of the Journal of Electronic Packaging has six papers selected from the second international conference on thermal issues in emerging technologies theory and applications. This conference (ThETA2) was held in Cairo, Egypt, December 17–20, 2008. The objectives of the conference are to encourage dissemination of information and research in areas related to transport and emerging technologies in various domains. The main conference objective is to address the growing impact of thermal issues on many advanced and emerging technologies including Microelectronics, Nanotechnology, Smart Materials, Micro-Electro-Mechanical Systems, Biomedical Engineering, and Green Energy. The importance of transport in these areas is becoming a dominant factor in determining the performance of such technologies. The ThETA2 conference was very successful and attracted many prominent researchers from the US, Europe, and the Far East to participate and interact with researchers from the Middle East, in general, and Egypt in particular. The seven papers presented in this special issue represent some of the best ideas presented at the conference, and deemed worthy of archival publication in the JEP after the papers were reviewed again by the JEP with Professor Mohamed-Nabil Sabry serving as the special guest editor for the issue. The ThETA2 executive committee consisted of Bernard Courtois, TIMA Lab., Grenoble, France, Yogendra Joshi, Georgia Inst. Technology, USA, Waturu Nakayama, Tokyo Inst. Technology, Japan, Mohamed-Nabil Sabry, U. Française d' Egypte, Bahgat Sammakia, Binghamton U., USA, and Mamdouh Shoukri, McMaster U., Canada. The chairmen for the conference were Mohamed-Nabil Sabry and Bernard Courtois.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleEditorial
    typeJournal Paper
    journal volume132
    journal issue3
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.3493694
    journal fristpage30201
    identifier eissn1043-7398
    keywordsPhysics
    keywordsTemperature
    keywordsHeat transfer
    keywordsCooling
    keywordsFluids
    keywordsWorkshops (Work spaces)
    keywordsReliability
    keywordsElectronic packaging
    keywordsSimulation
    keywordsSmart materials
    keywordsBiomedical engineering
    keywordsEngineering teachers
    keywordsMicroelectromechanical systems
    keywordsExperimental methods
    keywordsFuel cells
    keywordsHeat pipes
    keywordsMechatronics
    keywordsModeling
    keywordsNanotechnology
    keywordsOptimization
    keywordsTwo-phase flow
    keywordsComputers
    keywordsData centers
    keywordsElectronic systems
    keywordsJapan Society of Mechanical Engineers
    keywordsMicroelectronic devices AND Micro gas turbines
    treeJournal of Electronic Packaging:;2010:;volume( 132 ):;issue: 003
    contenttypeFulltext
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian