Journal of Electronic Packaging: Recent submissions
Now showing items 81-100 of 2074
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Module-Level Thermal Interface Material Degradation in HALT
(The American Society of Mechanical Engineers (ASME), 2022)In this study, thermal interface material (TIM) degradation is driven through highly accelerated life test (HALT) using temperature cycling with a prescribed vibrational acceleration for two commercially available materials ... -
HFE7500 Coolant Dielectric Strength Augmentation Under Convective Conditions
(The American Society of Mechanical Engineers (ASME), 2022)Power densification and rising module heat losses cannot be managed by traditional “external-to-case” cooling solutions. This is especially pronounced in high voltage systems, where intervening layers of insulating material ... -
Experimental Investigation of Boiling Heat Transfer in a Liquid Chamber With Partially Soluble Nanofluids
(The American Society of Mechanical Engineers (ASME), 2022)Boiling heat transfer (BHT) is a promising technique for cooling the high heat flux emitted from next-generation electronic devices. However, critical heat flux (CHF) is a significant problem in BHT because it restricts ... -
Solderability and Reliability of Sintered Nano-Ag Bond Pads of Printed Re-Distribution Layer
(The American Society of Mechanical Engineers (ASME), 2022)Redistribution layer (RDL) is one key enabling technology for advanced packaging. RDL is usually fabricated at wafer level by a photolithography process. An alternative approach for implementing RDL by additive manufacturing ... -
Special Section on InterPACK2021
(The American Society of Mechanical Engineers (ASME), 2023)The International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) is a flagship conference of ASME Electronic and Photonic Packaging Division (EPPD). It ... -
Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the DualPhaseLag Model
(The American Society of Mechanical Engineers (ASME), 2021)This study investigates the heat transport mechanism in semiconductor elements within a homogeneous thermoelectric cooling system using the dualphaselag (DPL) model. The thermal lagging behavior is analyzed and explored ... -
Parametric Effects on Pool Boiling Heat Transfer and Critical Heat Flux: A Critical Review
(The American Society of Mechanical Engineers (ASME), 2022)Pool boiling heat transfer offers high-performance cooling opportunities for thermal problems of electronics limited with high heat fluxes. Therefore, many researchers have been extensively studying over the last six ... -
Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink
(The American Society of Mechanical Engineers (ASME), 2022)The increased power consumption and continued miniaturization of high-powered electronic components have presented many challenges to their thermal management. To improve the efficiency and reliability of these devices, ... -
Simultaneous Measurement of Temperature and Strain in Electronic Packages Using Multiframe Super-Resolution Infrared Thermography and Digital Image Correlation
(The American Society of Mechanical Engineers (ASME), 2022)For micro-electronic components and systems, reliability under thermomechanical stress is of critical importance. Experimental characterization of hotspots and temperature gradients, which can lead to deformation in the ... -
Effect of Different Solder Volumes on the Laser Soldering Process: Numerical and Experimental Investigation
(The American Society of Mechanical Engineers (ASME), 2022)Laser soldering is becoming more popular for soldering pin through-hole (PTH) components onto printed circuit boards (PCBs). Solder volume influences soldering joint reliability. However, it is difficult to accurately ... -
Electrical Reliability of Flexible Silicon Package Integrated on Polymer Substrate During Repeated Bending Deformations
(The American Society of Mechanical Engineers (ASME), 2022)Although the reliability of flexible electronics during bending deformation is of great interest nowadays, the mechanical reliability that has mainly been investigated is of single electronic components or simple devices, ... -
Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints
(The American Society of Mechanical Engineers (ASME), 2022)Low-silver solders are increasingly being used because silver improves the tensile strength. In this study, the variation in fracture behavior with silver content in lead-free solder joints was studied using double cantilever ... -
A Novel Design of Rack Mount Server Thermal Simulator: Design, Assembly, and Experimental Verification
(The American Society of Mechanical Engineers (ASME), 2022)The practice of commissioning data centers (DCs) is necessary to confirm the compliance of the cooling system to the information technology equipment (ITE) load (design capacity). In a typical DC, there are different types ... -
Heat Transfer Analysis of Supercritical Methane in Microchannels With Different Geometric Configurations on High Power Electromechanical Actuator
(The American Society of Mechanical Engineers (ASME), 2022)The issue of regenerative cooling is one of the most important key technologies of flight vehicles, which is applied into both the engine and high-power electrical equipment. One pattern of regenerative cooling channels ... -
Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes
(The American Society of Mechanical Engineers (ASME), 2022)Recent years, the sintered silver paste was introduced and further developed for power electronics packaging due to low processing temperature and high working temperature. The pressure-less sintering technology reduces ... -
Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current
(The American Society of Mechanical Engineers (ASME), 2022)Printed electronics (PEs) have attracted attention for the fabrication of microscale electronic circuits. PEs use conductive inks which include metal nanoparticles. The conductive ink can be printed on flexible substrates ... -
Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics
(The American Society of Mechanical Engineers (ASME), 2022)In a two-phase immersion cooling system, boiling on the spreader surface has been experimentally found to be nonuniform, and it is highly related to the surface temperature and the heat transfer coefficient. An experimentally ... -
Prediction of Board Level Pad Cratering Strength With the Predefined Failure Criteria From Joint Level Testing
(The American Society of Mechanical Engineers (ASME), 2022)Conventional reliability tests for the evaluation of pad cratering resistance are mainly classified into two categories: the board level test and the joint level test. The board-level test is to imitate the loading conditions ... -
Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip Package
(The American Society of Mechanical Engineers (ASME), 2021)Recent advances in the micro-electronics industry have increased the demand for smaller and more compact package devices with higher performance. This paper presents an analytical multiparametric design optimization approach ... -
Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled Servers
(The American Society of Mechanical Engineers (ASME), 2021)Transistor density trends till recently have been following Moore's law, doubling every generation resulting in increased power density. The computational performance gains with the breakdown of Moore's law were achieved ...