Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of ElectronicsSource: Journal of Electronic Packaging:;2022:;volume( 144 ):;issue: 004::page 41011-1Author:Tong, Wei
,
Ganjali, Alireza
,
Ghaffari, Omidreza
,
Sayed, Chady al
,
Fréchette, Luc
,
Sylvestre, Julien
DOI: 10.1115/1.4053310Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In a two-phase immersion cooling system, boiling on the spreader surface has been experimentally found to be nonuniform, and it is highly related to the surface temperature and the heat transfer coefficient. An experimentally obtained temperature-dependent boiling heat transfer coefficient has been applied to a numerical model to investigate the spreader's cooling performance. It is found that the surface temperature distribution becomes less uniform with higher input power. But it is more uniform when the thickness is increased. By defining the characteristic temperatures that represent different boiling regimes on the surface, the fraction of the surface area that has reached the critical heat flux has been numerically calculated, showing that increasing the thickness from 1 mm to 6 mm decreases the critical heat flux reached area by 23% at saturation liquid temperatures. Therefore, on the thicker spreader, more of the surface is utilized for nucleate boiling while localized hot regions that lead to surface dry-out are avoided. At a base temperature of 90 °C, the optimal thickness is found to be 4 mm, beyond which no significant improvement in heat removal can be obtained. Lower coolant temperatures can further increase the heat removal
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contributor author | Tong, Wei | |
contributor author | Ganjali, Alireza | |
contributor author | Ghaffari, Omidreza | |
contributor author | Sayed, Chady al | |
contributor author | Fréchette, Luc | |
contributor author | Sylvestre, Julien | |
date accessioned | 2022-05-08T09:07:36Z | |
date available | 2022-05-08T09:07:36Z | |
date copyright | 1/28/2022 12:00:00 AM | |
date issued | 2022 | |
identifier issn | 1043-7398 | |
identifier other | ep_144_04_041011.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl1/handle/yetl/4284756 | |
description abstract | In a two-phase immersion cooling system, boiling on the spreader surface has been experimentally found to be nonuniform, and it is highly related to the surface temperature and the heat transfer coefficient. An experimentally obtained temperature-dependent boiling heat transfer coefficient has been applied to a numerical model to investigate the spreader's cooling performance. It is found that the surface temperature distribution becomes less uniform with higher input power. But it is more uniform when the thickness is increased. By defining the characteristic temperatures that represent different boiling regimes on the surface, the fraction of the surface area that has reached the critical heat flux has been numerically calculated, showing that increasing the thickness from 1 mm to 6 mm decreases the critical heat flux reached area by 23% at saturation liquid temperatures. Therefore, on the thicker spreader, more of the surface is utilized for nucleate boiling while localized hot regions that lead to surface dry-out are avoided. At a base temperature of 90 °C, the optimal thickness is found to be 4 mm, beyond which no significant improvement in heat removal can be obtained. Lower coolant temperatures can further increase the heat removal | |
description abstract | it is reduced from an 18% improvement in the input power for the 1 mm case to only 3% in the 6 mm case for a coolant temperature drop of 24 °C. Therefore, a tradeoff exists between the cost of maintaining the low liquid temperature and the increased heat removal capacity. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics | |
type | Journal Paper | |
journal volume | 144 | |
journal issue | 4 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.4053310 | |
journal fristpage | 41011-1 | |
journal lastpage | 41011-8 | |
page | 8 | |
tree | Journal of Electronic Packaging:;2022:;volume( 144 ):;issue: 004 | |
contenttype | Fulltext |