Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled ServersSource: Journal of Electronic Packaging:;2021:;volume( 144 ):;issue: 004::page 41008-1Author:Shahi, Pardeep
,
Deshmukh, Apruv Pravin
,
Hurnekar, Hardik Yashwant
,
Saini, Satyam
,
Bansode, Pratik
,
Kasukurthy, Rajesh
,
Agonafer, Dereje
DOI: 10.1115/1.4052324Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Transistor density trends till recently have been following Moore's law, doubling every generation resulting in increased power density. The computational performance gains with the breakdown of Moore's law were achieved by using multicore processors, leading to nonuniform power distribution and localized high temperatures making thermal management even more challenging. Cold plate-based liquid cooling has proven to be one of the most efficient technologies in overcoming these thermal management issues. Traditional liquid-cooled data center deployments provide a constant flow rate to servers irrespective of the workload, leading to excessive consumption of coolant pumping power. Therefore, a further enhancement in the efficiency of implementation of liquid cooling in data centers is possible. The present investigation proposes the implementation of dynamic cooling using an active flow control device to regulate the coolant flow rates at the server level. This device can aid in pumping power savings by controlling the flow rates based on server utilization. The flow control device design contains a V-cut ball valve connected to a microservo motor used for varying the device valve angle. The valve position was varied to change the flow rate through the valve by servomotor actuation based on predecided rotational angles. The device operation was characterized by quantifying the flow rates and pressure drop across the device by changing the valve position using both computational fluid dynamics and experiments. The proposed flow control device was able to vary the flow rate between 0.09 lpm and 4 lpm at different valve positions.
|
Collections
Show full item record
contributor author | Shahi, Pardeep | |
contributor author | Deshmukh, Apruv Pravin | |
contributor author | Hurnekar, Hardik Yashwant | |
contributor author | Saini, Satyam | |
contributor author | Bansode, Pratik | |
contributor author | Kasukurthy, Rajesh | |
contributor author | Agonafer, Dereje | |
date accessioned | 2022-05-08T09:07:28Z | |
date available | 2022-05-08T09:07:28Z | |
date copyright | 11/22/2021 12:00:00 AM | |
date issued | 2021 | |
identifier issn | 1043-7398 | |
identifier other | ep_144_04_041008.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl1/handle/yetl/4284753 | |
description abstract | Transistor density trends till recently have been following Moore's law, doubling every generation resulting in increased power density. The computational performance gains with the breakdown of Moore's law were achieved by using multicore processors, leading to nonuniform power distribution and localized high temperatures making thermal management even more challenging. Cold plate-based liquid cooling has proven to be one of the most efficient technologies in overcoming these thermal management issues. Traditional liquid-cooled data center deployments provide a constant flow rate to servers irrespective of the workload, leading to excessive consumption of coolant pumping power. Therefore, a further enhancement in the efficiency of implementation of liquid cooling in data centers is possible. The present investigation proposes the implementation of dynamic cooling using an active flow control device to regulate the coolant flow rates at the server level. This device can aid in pumping power savings by controlling the flow rates based on server utilization. The flow control device design contains a V-cut ball valve connected to a microservo motor used for varying the device valve angle. The valve position was varied to change the flow rate through the valve by servomotor actuation based on predecided rotational angles. The device operation was characterized by quantifying the flow rates and pressure drop across the device by changing the valve position using both computational fluid dynamics and experiments. The proposed flow control device was able to vary the flow rate between 0.09 lpm and 4 lpm at different valve positions. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled Servers | |
type | Journal Paper | |
journal volume | 144 | |
journal issue | 4 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.4052324 | |
journal fristpage | 41008-1 | |
journal lastpage | 41008-9 | |
page | 9 | |
tree | Journal of Electronic Packaging:;2021:;volume( 144 ):;issue: 004 | |
contenttype | Fulltext |