Journal of Electronic Packaging: Recent submissions
Now showing items 101-120 of 2074
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Effect of Wavy Wall and Plate Bifurcations on Heat Transfer Enhancement in Microchannel
(The American Society of Mechanical Engineers (ASME), 2021)Miniaturization of electronic components requires compact and effective cooling techniques to dissipate large heat flux without a significant increase in pumping power. Microchannel heat sink with liquid as working fluid ... -
Influence of Laser Soldering Temperatures on Through-Hole Component
(The American Society of Mechanical Engineers (ASME), 2021)The conventional method of selective soldering has been practiced using wave soldering, convection reflow, and hand soldering. However, due to industry automation and high demand for quality, repeatability and flexibility, ... -
Design and Fabrication of Leadless Package Structure for Pressure Sensors
(The American Society of Mechanical Engineers (ASME), 2021)Silicon piezoresistive pressure sensors can only operate below 125 °C due to the leakage current of the PN junction. However, silicon-on-insulator (SOI) high-temperature pressure sensors use SiO2 for total dielectric ... -
Design of Microfabricated Mechanically Interlocking Metamaterials for Reworkable Heterogeneous Integration
(The American Society of Mechanical Engineers (ASME), 2021)Next-generation interconnects utilizing mechanically interlocking structures enable permanent and reworkable joints between micro-electronic devices. Mechanical metamaterials, specifically dry adhesives, are an active area ... -
A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging
(The American Society of Mechanical Engineers (ASME), 2021)This paper presents a new approach to formulating an analytical model for the underfill process in flip-chip packaging to predict the flow front and the filling time. The new approach is based on the concept of surface ... -
Coupled Calculations of Data Center Cooling and Power Distribution Systems
(The American Society of Mechanical Engineers (ASME), 2021)Physics-based modeling aids in designing efficient data center power and cooling systems. These systems have traditionally been modeled independently under the assumption that the inherent coupling of effects between the ... -
Optimized Design of Various Ag Decorated Sn-xAg-Cu0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale Packaging
(The American Society of Mechanical Engineers (ASME), 2021)Effects of Ag content (0 ∼ 3 wt%) in Sn-xAgCu0.7 solders on microstructure characteristics and low cycling fatigue at different temperature conditions are overall investigated. To increase Ag content, the solidus points ... -
A New Structure of Ceramic Substrate to Reduce the Critical Electric Field in High Voltage Power Modules
(The American Society of Mechanical Engineers (ASME), 2022)The blocking voltage level of silicon carbide (SiC) can reach 10–25 kV, which will significantly increase the power density and capacity of power modules. However, high voltage can induce a high electric field, increase ... -
Experimental and Numerical Analysis of Data Center Pressure and Flow Fields Induced by Backward and Forward CRAH Technology
(The American Society of Mechanical Engineers (ASME), 2022)An increasingly common power saving practice in data center thermal management is to swap out air cooling unit blower fans with electronically commutated plug fans, Although, both are centrifugal blowers. The blade design ... -
Research on Reliability of Ni/Sn/Cu(Ni) Copper Pillar Bump Under Thermoelectric Loading
(The American Society of Mechanical Engineers (ASME), 2022)With the development of packaging devices toward high performance and high density, electronic devices are subjected to thermo-electric stresses under service conditions, which has become a particularly important reliability ... -
A Reduced Model Based on Proper Generalized Decomposition for the Fast Analysis of IGBT Power Modules Lifetime
(The American Society of Mechanical Engineers (ASME), 2022)A reduced weakly-coupled thermo-mechanical model based on the proper generalized decomposition method was developed for the numerical analysis of power modules. The employed model reduction method enabled us to obtain, in ... -
Recent Developments in Air Pumps for Thermal Management of Electronics
(The American Society of Mechanical Engineers (ASME), 2021)For electronics, poor thermal management could cause severe mechanical and electrical failures. Forced convective air cooling, i.e., flowing air over a hot surface, is one of the most efficient and economical solutions to ... -
Multifunctional Magnetic Nanocomposite Encapsulant for Electromagnetic Interference Shielding in Power Electronics
(The American Society of Mechanical Engineers (ASME), 2022)As power densities and switching frequencies dramatically increase in wide bandgap power electronics, electromagnetic interference (EMI) increasingly impacts power conversion efficiency, and reliability, which requires ... -
Simplified and Detailed Analysis of Data Center Particulate Contamination at Server and Room Level Using Computational Fluid Dynamics
(The American Society of Mechanical Engineers (ASME), 2022)Continuous rise in cloud computing and other web-based services propelled the data center proliferation seen over the past decade. Traditional data centers use vapor-compression-based cooling units that not only reduce ... -
Multilayer Conductive Metallization With Offset Vias Using Aerosol Jet Technology
(The American Society of Mechanical Engineers (ASME), 2022)The transition of additive printed electronics into high-volume production requires process consistency to allow quality control of the manufactured product. Process recipes are needed for multilayer substrates with z-axis ... -
Thermomechanical Topology Optimization of Three-Dimensional Heat Guiding Structures for Electronics Packaging
(The American Society of Mechanical Engineers (ASME), 2022)Heterogeneous and complex electronic packages may require unique thermomechanical structures to provide optimal heat guiding. In particular, when a heat source and a heat sink are not aligned and do not allow a direct path, ... -
Process-Recipe Development for Printing of Multilayer Circuitry With Z-Axis Interconnects Using Aerosol-Jet Printed Dielectric Vias
(The American Society of Mechanical Engineers (ASME), 2022)Flexible electronics is emerging as a new consumer-industry phenomenon. The promise of additively printed flexible electronics has sparked interest in a detailed understanding of the parameters and interactions of the ... -
Evolution of Anand Parameters for Thermally Aged Sn-Ag-Cu Lead-Free Alloys at Low Operating Temperature
(The American Society of Mechanical Engineers (ASME), 2022)In extreme environmental applications, such as aerospace and automotive, electronics may endure high or low operating temperatures during service, handling, and storage. An electronic assembly may experience strain rates ... -
High Temperature Degradation Modes Observed in Gallium Nitride-Based Hall-Effect Sensors
(The American Society of Mechanical Engineers (ASME), 2022)Magnetic field sensors based on the Hall-effect have a variety of applications such as current sensing in power electronics and position and velocity sensing in vehicles. Additionally, they have benefits such as easy ... -
Validation and Parametric Investigations of an Internal Permanent Magnet Motor Using a Lumped Parameter Thermal Model
(The American Society of Mechanical Engineers (ASME), 2022)One of the key challenges for the electric vehicle industry is to develop high-power-density electric motors. Achieving higher power density requires efficient heat removal from inside the motor. In order to improve thermal ...