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    High Temperature Degradation Modes Observed in Gallium Nitride-Based Hall-Effect Sensors

    Source: Journal of Electronic Packaging:;2022:;volume( 144 ):;issue: 002::page 21115-1
    Author:
    Krone, Alexis
    ,
    Kasitz, Josh
    ,
    Huitink, David
    ,
    Alpert, Hannah
    ,
    Senesky, Debbie G.
    ,
    Shetty, Satish
    ,
    Salamo, Gregory
    DOI: 10.1115/1.4053765
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Magnetic field sensors based on the Hall-effect have a variety of applications such as current sensing in power electronics and position and velocity sensing in vehicles. Additionally, they have benefits such as easy integration into circuits, low manufacturing cost, and linearity over a wide range of magnetic fields. However, in order to use these devices in an industrial or automotive setting, the effect of high temperatures on the reliability of the Hall-effect sensors needs to be evaluated. This study focuses on the effect of high temperature on the electrical and material properties of novel gallium nitride (GaN)-based Hall-effect sensors and the impacts on the reliability of these devices. Changes in device properties such as resistance and electrical response, as well as on the metallic contacts, are examined, using two sets of devices made with different substrates and contact metals. A probe station is used to characterize electrical responses, while an X-ray photo-electron spectrometer (XPS) and energy-dispersive X-ray (EDX) are used to characterize material interactions. The findings include saturation curves, the presence of gallium on the contacts of the octagonal device, and the activation energy of reaction responsible for resistance increase for the octagonal AlGaN/GaN devices. Additionally, the Greek cross AlGaN/GaN Hall sensors showed excellent thermal stability.
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      High Temperature Degradation Modes Observed in Gallium Nitride-Based Hall-Effect Sensors

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    contributor authorKrone, Alexis
    contributor authorKasitz, Josh
    contributor authorHuitink, David
    contributor authorAlpert, Hannah
    contributor authorSenesky, Debbie G.
    contributor authorShetty, Satish
    contributor authorSalamo, Gregory
    date accessioned2022-05-08T09:06:10Z
    date available2022-05-08T09:06:10Z
    date copyright3/7/2022 12:00:00 AM
    date issued2022
    identifier issn1043-7398
    identifier otherep_144_02_021115.pdf
    identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4284732
    description abstractMagnetic field sensors based on the Hall-effect have a variety of applications such as current sensing in power electronics and position and velocity sensing in vehicles. Additionally, they have benefits such as easy integration into circuits, low manufacturing cost, and linearity over a wide range of magnetic fields. However, in order to use these devices in an industrial or automotive setting, the effect of high temperatures on the reliability of the Hall-effect sensors needs to be evaluated. This study focuses on the effect of high temperature on the electrical and material properties of novel gallium nitride (GaN)-based Hall-effect sensors and the impacts on the reliability of these devices. Changes in device properties such as resistance and electrical response, as well as on the metallic contacts, are examined, using two sets of devices made with different substrates and contact metals. A probe station is used to characterize electrical responses, while an X-ray photo-electron spectrometer (XPS) and energy-dispersive X-ray (EDX) are used to characterize material interactions. The findings include saturation curves, the presence of gallium on the contacts of the octagonal device, and the activation energy of reaction responsible for resistance increase for the octagonal AlGaN/GaN devices. Additionally, the Greek cross AlGaN/GaN Hall sensors showed excellent thermal stability.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleHigh Temperature Degradation Modes Observed in Gallium Nitride-Based Hall-Effect Sensors
    typeJournal Paper
    journal volume144
    journal issue2
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4053765
    journal fristpage21115-1
    journal lastpage21115-8
    page8
    treeJournal of Electronic Packaging:;2022:;volume( 144 ):;issue: 002
    contenttypeFulltext
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