YaBeSH Engineering and Technology Library

    • Journals
    • PaperQuest
    • YSE Standards
    • YaBeSH
    • Login
    View Item 
    •   YE&T Library
    • ASME
    • Journal of Electronic Packaging
    • View Item
    •   YE&T Library
    • ASME
    • Journal of Electronic Packaging
    • View Item
    • All Fields
    • Source Title
    • Year
    • Publisher
    • Title
    • Subject
    • Author
    • DOI
    • ISBN
    Advanced Search
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Archive

    A Reduced Model Based on Proper Generalized Decomposition for the Fast Analysis of IGBT Power Modules Lifetime

    Source: Journal of Electronic Packaging:;2022:;volume( 144 ):;issue: 003::page 31013-1
    Author:
    Schuler, Louis
    ,
    Chamoin, Ludovic
    ,
    Khatir, Zoubir
    ,
    Berkani, Mounira
    ,
    Ouhab, Merouane
    ,
    Degrenne, Nicolas
    DOI: 10.1115/1.4053767
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A reduced weakly-coupled thermo-mechanical model based on the proper generalized decomposition method was developed for the numerical analysis of power modules. The employed model reduction method enabled us to obtain, in a preliminary offline phase, the solution of the thermo-mechanical problem over a large range of design parameters, with much time saving compared to a classical (brute force) multi-resolution finite element method. In an online postprocessing phase, the power module lifetime, modeled with a strain-life law, was then computed in a straightforward manner by rapidly evaluating the solution for any value of the parameters. Sensitivity analysis was conducted to select parameters values leading to acceptable module lifetimes with respect to given criteria. A robust design study was also performed to illustrate the performance of the proposed approach.
    • Download: (2.271Mb)
    • Show Full MetaData Hide Full MetaData
    • Get RIS
    • Item Order
    • Go To Publisher
    • Price: 5000 Rial
    • Statistics

      A Reduced Model Based on Proper Generalized Decomposition for the Fast Analysis of IGBT Power Modules Lifetime

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/4284740
    Collections
    • Journal of Electronic Packaging

    Show full item record

    contributor authorSchuler, Louis
    contributor authorChamoin, Ludovic
    contributor authorKhatir, Zoubir
    contributor authorBerkani, Mounira
    contributor authorOuhab, Merouane
    contributor authorDegrenne, Nicolas
    date accessioned2022-05-08T09:06:37Z
    date available2022-05-08T09:06:37Z
    date copyright3/7/2022 12:00:00 AM
    date issued2022
    identifier issn1043-7398
    identifier otherep_144_03_031013.pdf
    identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4284740
    description abstractA reduced weakly-coupled thermo-mechanical model based on the proper generalized decomposition method was developed for the numerical analysis of power modules. The employed model reduction method enabled us to obtain, in a preliminary offline phase, the solution of the thermo-mechanical problem over a large range of design parameters, with much time saving compared to a classical (brute force) multi-resolution finite element method. In an online postprocessing phase, the power module lifetime, modeled with a strain-life law, was then computed in a straightforward manner by rapidly evaluating the solution for any value of the parameters. Sensitivity analysis was conducted to select parameters values leading to acceptable module lifetimes with respect to given criteria. A robust design study was also performed to illustrate the performance of the proposed approach.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleA Reduced Model Based on Proper Generalized Decomposition for the Fast Analysis of IGBT Power Modules Lifetime
    typeJournal Paper
    journal volume144
    journal issue3
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4053767
    journal fristpage31013-1
    journal lastpage31013-10
    page10
    treeJournal of Electronic Packaging:;2022:;volume( 144 ):;issue: 003
    contenttypeFulltext
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian