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contributor authorSchuler, Louis
contributor authorChamoin, Ludovic
contributor authorKhatir, Zoubir
contributor authorBerkani, Mounira
contributor authorOuhab, Merouane
contributor authorDegrenne, Nicolas
date accessioned2022-05-08T09:06:37Z
date available2022-05-08T09:06:37Z
date copyright3/7/2022 12:00:00 AM
date issued2022
identifier issn1043-7398
identifier otherep_144_03_031013.pdf
identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4284740
description abstractA reduced weakly-coupled thermo-mechanical model based on the proper generalized decomposition method was developed for the numerical analysis of power modules. The employed model reduction method enabled us to obtain, in a preliminary offline phase, the solution of the thermo-mechanical problem over a large range of design parameters, with much time saving compared to a classical (brute force) multi-resolution finite element method. In an online postprocessing phase, the power module lifetime, modeled with a strain-life law, was then computed in a straightforward manner by rapidly evaluating the solution for any value of the parameters. Sensitivity analysis was conducted to select parameters values leading to acceptable module lifetimes with respect to given criteria. A robust design study was also performed to illustrate the performance of the proposed approach.
publisherThe American Society of Mechanical Engineers (ASME)
titleA Reduced Model Based on Proper Generalized Decomposition for the Fast Analysis of IGBT Power Modules Lifetime
typeJournal Paper
journal volume144
journal issue3
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.4053767
journal fristpage31013-1
journal lastpage31013-10
page10
treeJournal of Electronic Packaging:;2022:;volume( 144 ):;issue: 003
contenttypeFulltext


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