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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-10 of 11
Concurrent Thermal and Electrical Property Effects of Nano-Enhanced Phase Change Material for High-Voltage Electronics Applications
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Rapid temperature transients sustained during the operation of high-voltage electronics can be difficult to manage by relying solely on uniform heat removal mechanisms. Phase-change materials (PCMs) can be useful as a ...
Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction in Alternative Accelerated Mechanical Cycling Test
Publisher: American Society of Mechanical Engineers (ASME)
Abstract: In this work, a rapid and low-cost accelerated reliability test methodology which was designed to simulate mechanical stresses induced in flip–chip bonded devices during the thermal cycling reliability test under isothermal ...
A System to Package Perspective on Transient Thermal Management of Electronics
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: There are many applications throughout the military and commercial industries whose thermal profiles are dominated by intermittent and/or periodic pulsed thermal loads. Typical thermal solutions for transient applications ...
Thermomechanical Degradation of Thermal Interface Materials: Accelerated Test Development and Reliability Analysis
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Due to the inherently low adhesive strength and structural integrity of polymer thermal interface materials (TIMs), they present a likely point of failure when succumbed to thermomechanical stresses in electronics packaging. ...
Additive Manufactured Impinging Coolant, Low Electromagnetic Interference, and Nonmetallic Heat Spreader: Design and Optimization
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: With the increase of electronic device power density, thermal management and reliability are increasingly critical in the design of power electronic systems. First, increased density challenges the capability of conventional ...
Module-Level Thermal Interface Material Degradation in HALT
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this study, thermal interface material (TIM) degradation is driven through highly accelerated life test (HALT) using temperature cycling with a prescribed vibrational acceleration for two commercially available materials ...
HFE7500 Coolant Dielectric Strength Augmentation Under Convective Conditions
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Power densification and rising module heat losses cannot be managed by traditional “external-to-case” cooling solutions. This is especially pronounced in high voltage systems, where intervening layers of insulating material ...
System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application at High Coolant Temperatures and Off-Road Mission Profile
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Monitoring and predicting temperatures at critical locations of a power electronic system is important for safety, reliability, and efficiency. As the market share of vehicles with electric powertrains continues to increase, ...
Multifunctional Magnetic Nanocomposite Encapsulant for Electromagnetic Interference Shielding in Power Electronics
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: As power densities and switching frequencies dramatically increase in wide bandgap power electronics, electromagnetic interference (EMI) increasingly impacts power conversion efficiency, and reliability, which requires ...
High Temperature Degradation Modes Observed in Gallium Nitride-Based Hall-Effect Sensors
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Magnetic field sensors based on the Hall-effect have a variety of applications such as current sensing in power electronics and position and velocity sensing in vehicles. Additionally, they have benefits such as easy ...