Concurrent Thermal and Electrical Property Effects of Nano-Enhanced Phase Change Material for High-Voltage Electronics ApplicationsSource: Journal of Electronic Packaging:;2020:;volume( 142 ):;issue: 003Author:Iradukunda, Ange-Christian
,
Kasitz, Josh
,
Carlton, Hayden
,
Huitink, David
,
Deshpande, Amol
,
Luo, Fang
DOI: 10.1115/1.4046935Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Rapid temperature transients sustained during the operation of high-voltage electronics can be difficult to manage by relying solely on uniform heat removal mechanisms. Phase-change materials (PCMs) can be useful as a buffer against these intermittent temperature spikes when integrated into electronic packages. However, their integration poses challenges of both physical and electrical interactions within the package, particularly in high-voltage systems. This study aims to evaluate electrical and thermal properties of nano-enhanced PCMs to inform their integration in high-voltage systems. The nanocomposites are obtained by seeding 3 × 10−5 and 3 × 10−4 wt % of gold and iron oxide particles to sorbitol. Improvements in thermal properties including thermal conductivity as high as 8% are observed; however, this comes at the expense of the dielectric strength of the PCM. Additionally, an implementation scheme for the nano-enhanced PCMs in a high-voltage-capable power module is proposed with accompanying computational and experimental performance data.
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contributor author | Iradukunda, Ange-Christian | |
contributor author | Kasitz, Josh | |
contributor author | Carlton, Hayden | |
contributor author | Huitink, David | |
contributor author | Deshpande, Amol | |
contributor author | Luo, Fang | |
date accessioned | 2022-02-04T14:34:35Z | |
date available | 2022-02-04T14:34:35Z | |
date copyright | 2020/05/04/ | |
date issued | 2020 | |
identifier issn | 1043-7398 | |
identifier other | ep_142_03_031109.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl1/handle/yetl/4273944 | |
description abstract | Rapid temperature transients sustained during the operation of high-voltage electronics can be difficult to manage by relying solely on uniform heat removal mechanisms. Phase-change materials (PCMs) can be useful as a buffer against these intermittent temperature spikes when integrated into electronic packages. However, their integration poses challenges of both physical and electrical interactions within the package, particularly in high-voltage systems. This study aims to evaluate electrical and thermal properties of nano-enhanced PCMs to inform their integration in high-voltage systems. The nanocomposites are obtained by seeding 3 × 10−5 and 3 × 10−4 wt % of gold and iron oxide particles to sorbitol. Improvements in thermal properties including thermal conductivity as high as 8% are observed; however, this comes at the expense of the dielectric strength of the PCM. Additionally, an implementation scheme for the nano-enhanced PCMs in a high-voltage-capable power module is proposed with accompanying computational and experimental performance data. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Concurrent Thermal and Electrical Property Effects of Nano-Enhanced Phase Change Material for High-Voltage Electronics Applications | |
type | Journal Paper | |
journal volume | 142 | |
journal issue | 3 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.4046935 | |
page | 31109 | |
tree | Journal of Electronic Packaging:;2020:;volume( 142 ):;issue: 003 | |
contenttype | Fulltext |