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    Concurrent Thermal and Electrical Property Effects of Nano-Enhanced Phase Change Material for High-Voltage Electronics Applications

    Source: Journal of Electronic Packaging:;2020:;volume( 142 ):;issue: 003
    Author:
    Iradukunda, Ange-Christian
    ,
    Kasitz, Josh
    ,
    Carlton, Hayden
    ,
    Huitink, David
    ,
    Deshpande, Amol
    ,
    Luo, Fang
    DOI: 10.1115/1.4046935
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Rapid temperature transients sustained during the operation of high-voltage electronics can be difficult to manage by relying solely on uniform heat removal mechanisms. Phase-change materials (PCMs) can be useful as a buffer against these intermittent temperature spikes when integrated into electronic packages. However, their integration poses challenges of both physical and electrical interactions within the package, particularly in high-voltage systems. This study aims to evaluate electrical and thermal properties of nano-enhanced PCMs to inform their integration in high-voltage systems. The nanocomposites are obtained by seeding 3 × 10−5 and 3 × 10−4 wt % of gold and iron oxide particles to sorbitol. Improvements in thermal properties including thermal conductivity as high as 8% are observed; however, this comes at the expense of the dielectric strength of the PCM. Additionally, an implementation scheme for the nano-enhanced PCMs in a high-voltage-capable power module is proposed with accompanying computational and experimental performance data.
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      Concurrent Thermal and Electrical Property Effects of Nano-Enhanced Phase Change Material for High-Voltage Electronics Applications

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    http://yetl.yabesh.ir/yetl1/handle/yetl/4273944
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    contributor authorIradukunda, Ange-Christian
    contributor authorKasitz, Josh
    contributor authorCarlton, Hayden
    contributor authorHuitink, David
    contributor authorDeshpande, Amol
    contributor authorLuo, Fang
    date accessioned2022-02-04T14:34:35Z
    date available2022-02-04T14:34:35Z
    date copyright2020/05/04/
    date issued2020
    identifier issn1043-7398
    identifier otherep_142_03_031109.pdf
    identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4273944
    description abstractRapid temperature transients sustained during the operation of high-voltage electronics can be difficult to manage by relying solely on uniform heat removal mechanisms. Phase-change materials (PCMs) can be useful as a buffer against these intermittent temperature spikes when integrated into electronic packages. However, their integration poses challenges of both physical and electrical interactions within the package, particularly in high-voltage systems. This study aims to evaluate electrical and thermal properties of nano-enhanced PCMs to inform their integration in high-voltage systems. The nanocomposites are obtained by seeding 3 × 10−5 and 3 × 10−4 wt % of gold and iron oxide particles to sorbitol. Improvements in thermal properties including thermal conductivity as high as 8% are observed; however, this comes at the expense of the dielectric strength of the PCM. Additionally, an implementation scheme for the nano-enhanced PCMs in a high-voltage-capable power module is proposed with accompanying computational and experimental performance data.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleConcurrent Thermal and Electrical Property Effects of Nano-Enhanced Phase Change Material for High-Voltage Electronics Applications
    typeJournal Paper
    journal volume142
    journal issue3
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4046935
    page31109
    treeJournal of Electronic Packaging:;2020:;volume( 142 ):;issue: 003
    contenttypeFulltext
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