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contributor authorIradukunda, Ange-Christian
contributor authorKasitz, Josh
contributor authorCarlton, Hayden
contributor authorHuitink, David
contributor authorDeshpande, Amol
contributor authorLuo, Fang
date accessioned2022-02-04T14:34:35Z
date available2022-02-04T14:34:35Z
date copyright2020/05/04/
date issued2020
identifier issn1043-7398
identifier otherep_142_03_031109.pdf
identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4273944
description abstractRapid temperature transients sustained during the operation of high-voltage electronics can be difficult to manage by relying solely on uniform heat removal mechanisms. Phase-change materials (PCMs) can be useful as a buffer against these intermittent temperature spikes when integrated into electronic packages. However, their integration poses challenges of both physical and electrical interactions within the package, particularly in high-voltage systems. This study aims to evaluate electrical and thermal properties of nano-enhanced PCMs to inform their integration in high-voltage systems. The nanocomposites are obtained by seeding 3 × 10−5 and 3 × 10−4 wt % of gold and iron oxide particles to sorbitol. Improvements in thermal properties including thermal conductivity as high as 8% are observed; however, this comes at the expense of the dielectric strength of the PCM. Additionally, an implementation scheme for the nano-enhanced PCMs in a high-voltage-capable power module is proposed with accompanying computational and experimental performance data.
publisherThe American Society of Mechanical Engineers (ASME)
titleConcurrent Thermal and Electrical Property Effects of Nano-Enhanced Phase Change Material for High-Voltage Electronics Applications
typeJournal Paper
journal volume142
journal issue3
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.4046935
page31109
treeJournal of Electronic Packaging:;2020:;volume( 142 ):;issue: 003
contenttypeFulltext


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